CS5535-UDCF AMD (ADVANCED MICRO DEVICES), CS5535-UDCF Datasheet - Page 575
![no-image](/images/manufacturer_photos/0/0/44/amd__advanced_micro_devices__sml.jpg)
CS5535-UDCF
Manufacturer Part Number
CS5535-UDCF
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.CS5535-UDCF.pdf
(579 pages)
Specifications of CS5535-UDCF
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CS5535-UDCF
Manufacturer:
AMD
Quantity:
20 000
- Current page: 575 of 579
- Download datasheet (6Mb)
Package Specifications
AMD Geode™ C5535 companion device is packaged in a 208-terminal PBGA (plastic ball grid array). Figure 8-1 provides
the mechanical dimensions of the package.
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
2)
3)
4)
5)
AMD Geode™ CS5535 Companion Device Data Book
PBGA WITH LEAD (PB):
a) SOLDER BALL COMPOSITION: SN 63%, PB 37%.
b) SOLDERING PROFILE: 220o C.
PBGA LEAD (PB) FREE:
a) SOLDER BALL COMPOSITION: SN 96.5%, AG 3.5%.
b) SOLDERING PROFILE: 260o C
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION.
REFERENCE JEDEC REGISTRATION MO-151, VARIATION BAJ-2.
Figure 8-1. 208-Terminal PBGA Package (Body Size: 23x23x2.13 mm; Pitch: 1.27 mm)
8.0Package Specifications
31506B
8
575
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