TS8388BMFS9NB1 E2V, TS8388BMFS9NB1 Datasheet - Page 25

• Manufacturer Part Number: TS8388BMFS9NB1
• Manufacturer: E2V

Specifications of TS8388BMFS9NB1

• Lead Free Status / RoHS Status: Supplier Unconfirmed

5.3
5.3.1
Table 5-3. Thermal Resistance
5.3.2
5.3.3
TSEV8388B - Evaluation Board User Guide
Air Flow (m/s)
CBGA68 Thermal
Characteristics
Thermal Resistance
from Junction to
Ambient: Rthja
Thermal Resistance
from Junction to
Case: Rthjc
CBGA68 Board
Assembly with
External Heatsink
0.5
1.5
2.5
0
1
2
3
4
5
Estimated ja Thermal
Resistance (
The following table lists the converter thermal performance parameters of the device
itself, with no external heatsink added.
Typical value for Rthjc is given to 1.56°C/W.
This value does not include thermal contact resistance between package and external
component (heatsink or PCBoard).
As an example, 2.0°C/W can be taken for 50 µm of thermal grease.
It is recommended to use an external heatsink or PCBoard special design.
Cooling system efficiency can be monitored using the Temperature Sensing Diode, inte-
grated in the device.
Figure 5-4. CBGA68 Board Assembly
35.8
30.8
27.4
24.9
21.5
19.3
17.7
45
23
°
C/W)
24.2
Note: Dimensions are given in mm.
20.2
Figure 5-3. Thermal Resistance from Junction to Ambient: Rthja
50
40
30
20
10
0
0
1
50.5
0.65
31
2
Air flow (m/s)
3
4
Package Description
Board
5
32.5
0973D–BDC–02/09
5-5