TS8388BMFS9NB1 E2V, TS8388BMFS9NB1 Datasheet - Page 8

• Manufacturer Part Number: TS8388BMFS9NB1
• Manufacturer: E2V

Specifications of TS8388BMFS9NB1

• Lead Free Status / RoHS Status: Supplier Unconfirmed

0973D–BDC–02/09
Overview
1.4
1.5
1.6
1.7
1-4
e2v semiconductors SAS 2009
Analog Input,
Clock Input and
De-embedding
Fixture Accesses
Digital Outputs
Accesses
Power Supplies
and Ground
Accesses
ADC Functions
Settings
Accesses
The BT/Epoxy layer has been chosen because of its enhanced mechanical characteris-
tics for elevated temperature operation. The typical dielectric constant is 4.5 at 1 MHz.
More precisely, the BT/Epoxy dielectric layer offers enhanced characteristics compared
to FR4 Epoxy, namely:
The total board thickness is 2.6 mm. The previously described mechanical and fre-
quency characteristics makes the board particularly suitable for the device evaluation
and characterization in the high frequency domain and in the military temperature range.
The differential active inputs (Analog, Clock, De-embedding fixture) are provided by
SMA connectors.
Reference: VITELEC 142-0701-851.
Access to the differential output data port is provided by a 2.54 mm pitch connector,
compatible with the High Speed Digital Acquisition System. It enables access to the
converter output data, as well as proper 50Ω differential termination.
The power supplies accesses are provided by five 4 mm section banana jacks respec-
tively for V
The Ground accesses are provided by 4 mm and two 2 mm banana jacks.
For ADC functions settings accesses (GORB, Die junction temp., ADC gain adjust),
smaller 2 mm section banana jacks are provided.
A potentiometer is provided for ADC gain adjust.
Higher operating temperature value: 170°C (125°C for FR4).
Better with standing of thermal shocks (–65°C up to 170°C).
EEA
, V
EED
, V
EET
, V
DD
, V
PLUSD
and V
CC
TSEV8388B - Evaluation Board User Guide
.