TS8388BMFS9NB1 E2V, TS8388BMFS9NB1 Datasheet - Page 26

• Manufacturer Part Number: TS8388BMFS9NB1
• Manufacturer: E2V

Specifications of TS8388BMFS9NB1

• Lead Free Status / RoHS Status: Supplier Unconfirmed

0973D–BDC–02/09
Package Description
5.4
5.4.1
5.4.2
5-6
e2v semiconductors SAS 2009
Nominal CQFP68
Thermal
Characteristics
Thermal Resistance
from Junction to
Ambient: Rthja
Thermal Resistance
from Junction to
Case: Rthjc
Although the power dissipation is low for this performance, the use of a heat sink is
mandatory.
The user will find some advice on this topics below.
The following table lists the converter thermal performance parameters, with or without
heatsink.
For the following measurements, a 50 x 50 x 16 mm heatsink has been used (see Fig-
ure 5-6 on page 7).
Table 5-4. Thermal Resitance
Note:
Figure 5-5. Thermal Resistance from Junction to Ambient: Rthja
Typical value for Rthjc is given to 4.75°C/W.
Air Flow (m/s)
1. Heatsink is glued to backside of package or screwed and pressed with thermal
0.5
1.5
2.5
0
1
2
3
4
5
grease.
60
50
40
30
20
10
0
Estimated – Without Heatsink
0
ja Thermal Resistance (
1
23.5
50
40
35
32
30
28
26
24
Air flow (m/s)
2
TSEV8388B - Evaluation Board User Guide
3
Without heatsink
With heatsink
°
C/W) – CQFP68 on Board
4
Targeted – With Heatsink
5
8.9
7.9
7.3
6.8
6.5
6.2
5.8
5.6
10
(1)