TS8388BMFS9NB1 E2V, TS8388BMFS9NB1 Datasheet - Page 28

• Manufacturer Part Number: TS8388BMFS9NB1
• Manufacturer: E2V

Specifications of TS8388BMFS9NB1

• Lead Free Status / RoHS Status: Supplier Unconfirmed

0973D–BDC–02/09
Package Description
5.5
5.5.1
5.5.2
5.5.3
5-8
e2v semiconductors SAS 2009
Enhanced
CQFP68 Thermal
Characteristics
Enhanced CQFP68
Thermal Resistance
from Junction to
Case: Rthjc
Heatsink
The CQFP68 has been modified, in order to improve the thermal characteristics:
Typical value for Rthjc is given to 1.56°C/W.
This value does not include thermal contact resistance between package and external
component (heatsink or PCBoard).
As an example, 2.0°C/W can be taken for 50 µm of thermal grease.
It is recommended to use an external heatsink, or PCBoard special design.
The stand off has been calculated to permit the simultaneous soldering of the leads and
of the heatspreader with the solder paste.
Figure 5-7. Enhanced CQFP68 Suggested Assembly
Cooling system efficiency can be monitored using the Temperature Sensing Diode, inte-
grated in the device.
circuit board
A CuW heatspreader has been added at the bottom of the package.
The die has been electrically isolated with the ALN substrate.
CuW heatspreader
Printed
28.78
24.13
TSEV8388B - Evaluation Board User Guide
Thermal via
Solid ground plane