SI5317C-C-GMR Silicon Laboratories Inc, SI5317C-C-GMR Datasheet - Page 31

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SI5317C-C-GMR

Manufacturer Part Number
SI5317C-C-GMR
Description
Manufacturer
Silicon Laboratories Inc
Datasheet

Specifications of SI5317C-C-GMR

Lead Free Status / RoHS Status
Supplier Unconfirmed
Because the crystal is used as a jitter reference, rapid changes of the crystal temperature can temporarily disturb
the output phase and frequency. For example, it is recommended that the crystal not be placed close to a fan that
is being turned off and on. If a situation such as this is unavoidable, the crystal should be thermally isolated with an
insulating cover.
5.1.1. XA/XB Clock Drift
During VCO freeze, long-term and temperature-related drift of the XA/XB clock input results in a one-to-one drift of
the output frequency. The stability of the any frequency output is identical to the drift of the XA/XB frequency. This
means that for the most demanding applications where the drift of a crystal is not acceptable, an external
temperature-compensated or ovenized oscillator will be required. Drift is not an issue unless the part is in VCO
freeze. Also, the initial accuracy of the XA/XB oscillator (or crystal) is not relevant.
5.1.2. XA/XB Jitter
Jitter on the XA/XB input has a roughly one-to-one transfer function to the output jitter over the bandwidth ranging
from 100 Hz up to 30 kHz. If a crystal is used on the XA/XB pins, this will have low jitter if a suitable crystal is in
use. If the XA/XB pins are connected to an external oscillator, the jitter of the external oscillator may contribute
significantly to the output jitter.
RATE[1:0]
MM
HM
MH
HH
ML
LM
HL
LH
LL
3rd overtone crystal
Table 14. XA/XB Reference Sources and Frequencies
External clock
External clock
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Type
Rev. 1.0
Recommended
114.285 MHz
114.285 MHz
38.88 MHz
Lower limit
109 MHz
37 MHz
Si5317
Upper limit
125.5 MHz
41 MHz
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