PIC16F631-I/P Microchip Technology Inc., PIC16F631-I/P Datasheet - Page 279

• Manufacturer Part Number: PIC16F631-I/P
• Description: MCU, 8-Bit, 1KW Flash, 64 RAM, 18 I/O, PDIP-20
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F631-I/P

• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 128 Bytes
• Input Output: 18
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 20-pin PDIP
• Programmable Memory: 1.75K Bytes
• Ram Size: 64 Bytes
• Speed: 20 MHz
• Timers: 1-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
20-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1 2 3
b
PIC16F631/677/685/687/689/690
D
Dimension Limits
α
e
E1
A2
Units
A2
A1
E1
L1
N
D
e
A
E
h
L
b
α
β
φ
c
E
φ
2.05
0.10
0.25
0.40
0.20
0.31
MIN
0°
5°
5°
–
L
h
MILLIMETERS
L1
10.30 BSC
12.80 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
20
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-094B
h
β
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS41262D-page 277
c