PIC16F631-I/P Microchip Technology Inc., PIC16F631-I/P Datasheet - Page 281

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PIC16F631-I/P

Manufacturer Part Number
PIC16F631-I/P
Description
MCU, 8-Bit, 1KW Flash, 64 RAM, 18 I/O, PDIP-20
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC16F631-I/P

Comparators
2
Cpu Speed
5 MIPS
Eeprom Memory
128 Bytes
Input Output
18
Memory Type
Flash
Number Of Bits
8
Package Type
20-pin PDIP
Programmable Memory
1.75K Bytes
Ram Size
64 Bytes
Speed
20 MHz
Timers
1-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F631-I/P
Manufacturer:
MICROCHIP
Quantity:
4 500
Part Number:
PIC16F631-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
A3
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
PIC16F631/677/685/687/689/690
N
Dimension Limits
A1
2
1
EXPOSED
A
E
Units
PAD
NOTE 1
A1
A3
E2
D2
D
N
A
E
K
e
b
L
E2
1
2
MIN
0.80
0.00
2.60
2.60
0.18
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.50 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.70
2.70
0.25
0.40
20
Microchip Technology Drawing C04-126B
D2
MAX
1.00
0.05
2.80
2.80
0.30
0.50
DS41262D-page 279
L
b
e
K

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