PIC16F72-I/SP Microchip Technology Inc., PIC16F72-I/SP Datasheet - Page 64
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PIC16F72-I/SP
Manufacturer Part Number
PIC16F72-I/SP
Description
28 PIN, 3.5 KB FLASH, 128 RAM, 22 I/O
Manufacturer
Microchip Technology Inc.
Datasheet
1.PIC16F72-ISP.pdf
(136 pages)
Specifications of PIC16F72-I/SP
A/d Inputs
5-Channel, 8-Bit
Cpu Speed
5 MIPS
Eeprom Memory
0 Bytes
Input Output
22
Interface
I2C/SPI
Memory Type
Flash
Number Of Bits
8
Package Type
28-pin SPDIP
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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PIC16F72
TABLE 11-2:
DS39597B-page 62
Osc Type
Capacitor values are for design guidance only.
These capacitors were tested with the crystals listed
below for basic start-up and operation. These values
were not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following this table for additional
information.
DD
Note 1: Higher capacitance increases the stability
XT
HS
LP
and temperature range for the application.
2: Since each resonator/crystal has its own
3: Rs may be required in HS mode, as well
4: Always verify oscillator performance over
of oscillator, but also increases the
start-up time.
characteristics, the user should consult the
resonator/crystal manufacturer for appro-
priate values of external components.
as XT mode, to avoid overdriving crystals
with low drive level specification.
the V
expected for the application.
200 kHz
200 kHz
Crystal
20 MHz
32 kHz
1 MHz
4 MHz
4 MHz
8 MHz
Freq
CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR (FOR
DESIGN GUIDANCE ONLY)
DD
and temperature range that is
Typical Capacitor Values
33 pF
15 pF
56 pF
15 pF
15 pF
15 pF
15 pF
15 pF
C1
Tested:
33 pF
15 pF
15 pF
15 pF
15 pF
15 pF
56 pF
15 pF
C2
11.2.3
For timing insensitive applications, the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (R
ing temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
C
variation due to tolerance of external R and C com-
ponents used. Figure 11-3 shows how the R/C
combination is connected to the PIC16F72.
FIGURE 11-3:
11.3
The PIC16F72 differentiates between various kinds of
RESET:
• Power-on Reset (POR)
• MCLR Reset during normal operation
• MCLR Reset during SLEEP
• WDT Reset (during normal operation)
• WDT Wake-up (during SLEEP)
• Brown-out Reset (BOR)
Some registers are not affected in any RESET condi-
tion. Their status is unknown on POR and unchanged
in any other RESET. Most other registers are reset to a
“RESET state” on Power-on Reset (POR), on the
MCLR and WDT Reset, on MCLR Reset during
SLEEP, and Brown-out Reset (BOR). They are not
affected by a WDT Wake-up, which is viewed as the
resumption of normal operation. The TO and PD bits
are set or cleared differently in different RESET situa-
tions, as indicated in Table 11-4. These bits are used in
software to determine the nature of the RESET. See
Table 11-6 for a full description of RESET states of all
registers.
A simplified block diagram of the on-chip RESET circuit
is shown in Figure 11-4.
Recommended values:
EXT
C
V
R
EXT
SS
EXT
EXT
values. The user also needs to take into account
V
DD
) and capacitor (C
RESET
RC OSCILLATOR
F
OSC
/4
RC OSCILLATOR MODE
OSC1
OSC2/CLKO
2002 Microchip Technology Inc.
EXT
3 k Ω ≤ R
C
EXT
) values, and the operat-
> 20 pF
EXT
≤ 100 k Ω
PIC16F72
Internal
Clock