LH28F160BVE-BTL90 Sharp Electronics, LH28F160BVE-BTL90 Datasheet - Page 42

• Manufacturer Part Number: LH28F160BVE-BTL90
• Manufacturer: Sharp Electronics

Specifications of LH28F160BVE-BTL90

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 21/20Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: 0C to 70C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 2M/1M
• Supply Current: 30mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

SHARP
Mount ing met hod
Measurement point
Note
Product name(Package)
Packing specification
Reflow soldering
Storage conditions
Recommnded Reflow SoIdering(Air)
Recommended mounting conditions
conditions
I
LH28F160BVE-BTL90 (TSOP48-P-1220)
Tray (Dry packing)
Reflow soldering
Preheat temperature
After
within
The recommended conditions
LHF16V09
Peak temperature
200°C or over,
than 180 seconds. Temperature
l--4Wsecond.
IC package surface
an environment
a relative
If doing reflow
reflow
dry packing and do the second reflow
If the above
applicable,
at 120°C.
(Heat resistance
Time
LHF16V09
_
opening the dry packing,
soldering
72 hours after
humidity
for two time reflow
bake it before reflow
Temperature Profile
storage
duration
with a temperature
soldering
of 230°C or less.
within
tray
(Air)
Peak
of 12%150”C,duration
of 60% or less.
conditions
the first
is used for shipping
tampa rature
of less
72 hours after
twice,do
are 16-24 hours
increase
soldering
store
than 40 seconds.
reflow
are not
of 5%25’% and
soldering.
the first
the ICs in
soldering
rate of
opening
soldering.
.
tray.)
of less