LPC1850FET256 NXP Semiconductors, LPC1850FET256 Datasheet - Page 136

• Manufacturer Part Number: LPC1850FET256
• Description: The LPC1850FET256 is a high-performance, cost-effective Cortex-M3 microcontroller featuring 200 kB of SRAM, and advanced peripherals including Ethernet, High Speed USB 2
• Manufacturer: NXP Semiconductors

NXP Semiconductors
15. Soldering
LPC1850_30_20_10
Preliminary data sheet
Fig 47. Reflow soldering of the LBGA256 package
Footprint information for reflow soldering of LBGA256 package
DIMENSIONS in mm
1.00
P
0.450
SL
0.450
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.600
SR
P
17.500 17.500
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 15 December 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
detail X
SR
SL
SP
see detail X
© NXP B.V. 2011. All rights reserved.
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