OM6208 NXP Semiconductors, OM6208 Datasheet - Page 61

• Manufacturer Part Number: OM6208
• Description: Om6208 65 X 96 Pixels Matrix Grey-scale Lcd Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Table 29 Chip information
2003 feb 10
Minimum bump
distance
Wafer thickness
(excl. bumps)
handbook, halfpage
Row/column side
Pad pitch
CBB opening
Bump dimensions
Bump height
Minimum bump
distance
Wafer thickness
(excl. bumps)
Interface side
Pad pitch
CBB opening
Bump dimensions
Bump height
65 x 96 pixels matrix grey-scale LCD driver
ITEM
Fig.49 Shape of alignment mark.
y
centre
51.84 (minimum)
15.3
30.0
15.0
21.8
381 ( 25)
63 (minimum)
25.7
42
15.0
shortened bumps: 21
normal bumps: 22
381 ( 25)
ROW/COL SIDE
90 ( 3)
x
centre
5.4
99 ( 3)
5.4
MGW846
90
m
m
m
m
m
m
m
m
m
m
m
m
m
UNIT
61
handbook, halfpage
handbook, halfpage
2.840
mm
Fig.50 Shape of bump alignment mark.
y
centre
Fig.48 Chip size and pad pitch.
x
y
x
60 m
10.140 mm
centre
OM6208
pitch
MGW847
60 m
Product specification
bump distance
OM6208
MGW845