MT55L1MY18F Micron Semiconductor Products, Inc., MT55L1MY18F Datasheet - Page 26
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MT55L1MY18F
Manufacturer Part Number
MT55L1MY18F
Description
18Mb ZBT SRAM, 3.3V Vdd, 2.5V or 3.3V I/O; 2.5V Vdd, 2.5V I/O, Flow-Through,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet
1.MT55L1MY18F.pdf
(34 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT55L1MY18FF-10 ES
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT55L1MY18FF-12
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT55L1MY18FF-12 ES
Manufacturer:
MICRON/美光
Quantity:
20 000
Table 19: TAP AC Electrical Characteristics
Notes 1, 2; 0ºC £ T
NOTE:
18Mb: 1 Meg x 18, 512K x 32/36 Flow-through ZBT SRAM
MT55L1MY18F_16_D.fm – Rev. D, Pub. 2/03
DESCRIPTION
Clock
Clock cycle time
Clock frequency
Clock HIGH time
Clock LOW time
Output Times
TCK LOW to TDO unknown
TCK LOW to TDO valid
TDI valid to TCK HIGH
TCK HIGH to TDI invalid
Setup Times
TMS setup
Capture setup
Hold Times
TMS hold
Capture hold
1.
2. Test conditions are specified using the loads in Figures 18 and 19.
t
CS and
t
CH refer to the setup and hold time requirements of latching data from the boundary scan register.
A
£ +70ºC; V
Test Mode Select
Test Data-Out
Test Data-In
Test Clock
DD
(TDO)
(TMS)
(TCK)
(TDI)
= 3.3V ±0.165V or 2.5V ±0.125V
1
t MVTH
t DVTH
TAP Timing
2
Figure 17:
t THTL
t THMX
t THDX
26
t
TLTH
18Mb: 1 MEG x 18, 512K x 32/36
3
t THTH
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DON’T CARE
SYMBOL
FLOW-THROUGH ZBT SRAM
t
t
t
t
t
t
t
t
t
MVTH
THMX
DVTH
THDX
THTH
TLOX
TLOV
THTL
TLTH
t
4
f
t
CH
TF
CS
t TLOX
t TLOV
5
MIN
100
40
40
10
10
10
10
10
10
UNDEFINED
0
6
MAX
10
20
©2003 Micron Technology, Inc.
UNITS
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns