MT28F320A18 Micron Technology, MT28F320A18 Datasheet - Page 36

• Manufacturer Part Number: MT28F320A18
• Description: FLASH MEMORY
• Manufacturer: Micron Technology

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DataSheet
Notes: 1. All dimensions in millimeters.
DATA SHEET DESIGNATIONS
No Marking:This data sheet contains minimum and maximum limits specified over the complete power supply
2 Meg x 16, 1.8V Enhanced+ Boot Block Flash Memory
MT28F320A18_F.fm – Rev F 08/03 EN
4
PRE-REFLOW DIAMETER IS Ø .33mm.
SOLDER BALL DIAMETER REFERS TO
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POST REFLOW CONDITION. THE
2. Micron recommends a one-to-one ratio between the solder ball pad and the PCB. For more information, see
SEATING PLANE
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
6.50 ±0.10
Micron Technical Note, TN-00-11, “SMT Recommendations for BGA Assembly.”
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur.
0.10
1.875 ±0.05
3.25 ±0.05
C
47X Ø
BALL A8
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.35
0.80 ±.075
C
2.625 ±0.05
1.8V ENHANCED+ BOOT BLOCK FLASH MEMORY
7.00 ±0.10
5.25
C L
3.50 ±0.05
47-BALL FBGA
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BALL A1
0.75
TYP
C L
0.75 TYP
36
PIN A1 ID
3.75
1.20 MAX
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø 0.27mm
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
2 MEG x 16
PIN A1 ID
©2003 Micron Technology Inc.