SST89E554 SST [Silicon Storage Technology, Inc], SST89E554 Datasheet - Page 47

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SST89E554

Manufacturer Part Number
SST89E554
Description
FlashFlex51 MCU
Manufacturer
SST [Silicon Storage Technology, Inc]
Datasheet

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FlashFlex51 MCU
SST89E564 / SST89V564 / SST89E554 / SST89V554
Preliminary Specifications
10.0 ELECTRICAL SPECIFICATION
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to + 150°C
Voltage on EA# Pin to V
Transient Voltage (<20ns) on Any Other Pin to V
Maximum I
Maximum I
Package Power Dissipation Capability (T
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current
Note: This specification contains preliminary information on new products in production.
10.1 Operation Range
TABLE 10-1: O
10.2 Reliability Characteristics
TABLE 10-2: R
©2001 Silicon Storage Technology, Inc.
Symbol
T
V
f
Symbol
N
T
I
OSC
LTH
a
DR
DD
END
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
1
1
(Based on package heat transfer limitations, not device power consumption.
The specifications are subject to change without notice.
1
OL
OL
per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Description
Ambient Temperature Under Bias
Supply Voltage
Oscillator Frequency
ELIABILITY
PERATING
Parameter
Endurance
Data Retention
Latch Up
Standard
Industrial
For In-Application Programming
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
R
1
C
ANGE
HARACTERISTICS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
a
= 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +6.5V
Minimum Specification
47
100 + I
10,000
100
DD
Min.
0.25
-40
2.7
0
0
Cycles
Units
Years
mA
Max
+70
+85
5.5
40
40
Test Method
JEDEC Standard A117
JEDEC Standard A103
JEDEC Standard 78
S71181-03-000 9/01
MHz
MHz
Unit
°
°
V
C
C
T10-1.1 384
T10-2.0 384
384

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