vsc055xkm-01 Maxim Integrated Products, Inc., vsc055xkm-01 Datasheet - Page 131
vsc055xkm-01
Manufacturer Part Number
vsc055xkm-01
Description
Enhanced I?c Backplane Controller
Manufacturer
Maxim Integrated Products, Inc.
Datasheet
1.VSC055XKM-01.pdf
(133 pages)
- Current page: 131 of 133
- Download datasheet (2Mb)
VSC055-01
Data Sheet
6
6.1
Table 33. Thermal Resistances
6.2
6.3
Package Information
The VSC055-01 device is available in two package types. VSC055KM-01 is a 100-pin, plastic quad flat
package (QFP) with a 20 mm body width, 14 mm body length, 2.7 mm body thickness, 0.65 mm pitch,
and 3.1 mm maximum height. The device is also available in a lead(Pb)-free package, VSC055XKM-01.
Lead(Pb)-free products from Maxim comply with the temperatures and profiles defined in the joint IPC
and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
Thermal Specifications
Thermal specifications for this device are based on the JEDEC standard EIA/JESD51-2 and have been
modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p
PCB). For more information, see the JEDEC standard.
To achieve results similar to the modeled thermal resistance measurements, the guidelines for board design
described in the JEDEC standard EIA/JESD51 series must be applied. For information about specific
applications, see the following:
EIA/JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment
Mechanisms
EIA/JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
EIA/JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
EIA/JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
EIA/JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements
Moisture Sensitivity
This device is rated moisture sensitivity level 3 or better as specified in the joint IPC and JEDEC standard
IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
Package Drawing
The following illustration shows the package drawing for the VSC055-01 device. The drawing contains
the top view, side view, detail views, dimensions, tolerances, and notes.
Part Order Number
VSC055KM-01
VSC055XKM-01
25.9
21.6
θ
JC
131 of 133
48.78
45.68
0
θ
JA
(°C/W) vs. Airflow (ft/min)
45.04
41.94
100
January 2008
43.31
40.22
200
Revision 4.1
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