CY7C1480V33 Cypress Semiconductor, CY7C1480V33 Datasheet - Page 7

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CY7C1480V33

Manufacturer Part Number
CY7C1480V33
Description
(CY7C1480V33 / CY7C1482V33 / CY7C1486V33) 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
Manufacturer
Cypress Semiconductor
Datasheet

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Document #: 38-05283 Rev. *C
Pin Definitions
Pin Name
A
BW
BW
GW
BWE
CLK
CE
CE
CE
OE
ADV
ADSP
ADSC
ZZ
DQs, DQPs
V
V
V
V
MODE
0
DD
SS
SSQ
DDQ
, A
1
2
3
A
E
,BW
,BW
1
, A
B
F
,BW
,BW
G
C
,BW
,BW
H
D
,
Asynchronous
Asynchronous
Power Supply Power supply inputs to the core of the device.
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
I/O Ground
Input Static
I/O Power
Ground
Supply
Input-
Input-
Input-
Input-
Input-
Clock
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
I/O-
I/O
Address Inputs used to select one of the address locations. Sampled at the rising
edge of the CLK if ADSP or ADSC is active LOW, and CE
active. A1: A0 are fed to the two-bit counter.
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to
the SRAM. Sampled on the rising edge of CLK.
Global Write Enable Input, active LOW. When asserted LOW on the rising edge of
CLK, a global write is conducted (ALL bytes are written, regardless of the values on
BW
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal
must be asserted LOW to conduct a byte write.
Clock Input. Used to capture all synchronous inputs to the device. Also used to
increment the burst counter when ADV is asserted LOW, during a burst operation.
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in
conjunction with CE
HIGH.
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in
conjunction with CE
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in
conjunction with CE
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O
pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are
tri-stated, and act as input data pins. OE is masked during the first clock of a read cycle
when emerging from a deselected state.
Advance Input signal, sampled on the rising edge of CLK, active LOW. When
asserted, it automatically increments the address in a burst cycle.
Address Strobe from Processor, sampled on the rising edge of CLK, active LOW.
When asserted LOW, addresses presented to the device are captured in the address
registers. A1: A0 are also loaded into the burst counter. When ADSP and ADSC are
both asserted, only ADSP is recognized. ASDP is ignored when CE
HIGH.
Address Strobe from Controller, sampled on the rising edge of CLK, active LOW.
When asserted LOW, addresses presented to the device are captured in the address
registers. A1: A0 are also loaded into the burst counter. When ADSP and ADSC are
both asserted, only ADSP is recognized.
ZZ “sleep” Input, active HIGH. When asserted HIGH places the device in a
non-time-critical “sleep” condition with data integrity preserved. For normal operation,
this pin has to be LOW or left floating. ZZ pin has an internal pull-down.
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is
triggered by the rising edge of CLK. As outputs, they deliver the data contained in the
memory location specified by the addresses presented during the previous clock rise
of the read cycle. The direction of the pins is controlled by OE. When OE is asserted
LOW, the pins behave as outputs. When HIGH, DQs and DQP
condition.
Ground for the core of the device.
Ground for the I/O circuitry.
Power supply for the I/O circuitry.
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to
V
remain static during device operation. Mode Pin has an internal pull-up.
DD
X
or left floating selects interleaved burst sequence. This is a strap pin and should
and BWE).
PRELIMINARY
2
1
1
and CE
and CE
and CE
3
2
3
to select/deselect the device. ADSP is ignored if CE
to select/deselect the device.
to select/deselect the device.
Description
1
, CE
X
CY7C1482V33
CY7C1486V33
CY7C1480V33
2
, and CE
are placed in a tri-state
1
is deasserted
3
Page 7 of 30
are sampled
1
is

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