CY7C1355C-100AC CYPRESS [Cypress Semiconductor], CY7C1355C-100AC Datasheet - Page 29

• Manufacturer Part Number: CY7C1355C-100AC
• Description: 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document #: 38-05539 Rev. **
Ordering Information
Shaded areas contain advance information.
Please contact your local sales representative for availability of these parts.
Speed
(MHz)
100
CY7C1355C-117BZC
CY7C1357C-117BZC
CY7C1355C-117BZI
CY7C1357C-117BZI
CY7C1355C-100AC
CY7C1357C-100AC
CY7C1355C-100AI
CY7C1357C-100AI
CY7C1355C-100BGC
CY7C1357C-100BGC
CY7C1355C-100BGI
ICY7C1357C-100BGI
CY7C1355C-100BZC
CY7C1357C-100BZC
CY7C1355C-100BZI
CY7C1357C-100BZI
Ordering Code
(continued)
Package
BB165D
BB165D
BB165D
BB165D
BG119
BG119
Name
A101
A101
PRELIMINARY
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
3 Chip Enables and JTAG
Part and Package Type
CY7C1355C
CY7C1357C
Commercial
Commercial
Commercial
Commercial
Page 29 of 33
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Industrial
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