ADV7390BCPZ-REEL AD [Analog Devices], ADV7390BCPZ-REEL Datasheet - Page 95

• Manufacturer Part Number: ADV7390BCPZ-REEL
• Description: Low Power, Chip Scale 10-Bit SD/HD Video Encoder
• Manufacturer: AD [Analog Devices]

OUTLINE DIMENSIONS
INDICATOR
INDICATOR
1.00
0.85
0.80
1.00
0.85
0.80
PIN 1
PIN 1
12° MAX
12° MAX
SEATING
PLANE
SEATING
PLANE
BSC SQ
BSC SQ
VIEW
TOP
VIEW
5.00
6.00
TOP
Figure 142. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.80 MAX
0.65 TYP
0.30
0.23
0.18
Figure 143. 40-Lead Frame Chip Scale Package [LFCSP]
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
BSC SQ
BCS SQ
0.20 REF
0.20 REF
4.75
5.75
5 mm × 5 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
0.05 MAX
0.02 NOM
0.05 MAX
0.02 NOM
Rev. 0 | Page 95 of 96
COPLANARITY
0.60 MAX
0.60 MAX
(CP-32-2)
(CP-40)
0.08
COPLANARITY
BSC
0.50
0.40
0.30
0.50
0.50
BSC
0.50
0.40
0.30
0.08
24
17
16
25
30
ADV7390/ADV7391/ADV7392/ADV7393
21
(BOTTOM VIEW)
0.60 MAX
31
20
0.60 MAX
(BOT TOM VIEW)
EXPOSED
EXPOSED
3.50 REF
PAD
PAD
4.50
REF
40
10
9
32
1
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
1
8
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
PIN 1
INDICATOR
0.25 MIN
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
4.25
4.10 SQ
3.95