HYB18H1G321AF QIMONDA [Qimonda AG], HYB18H1G321AF Datasheet - Page 43

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HYB18H1G321AF

Manufacturer Part Number
HYB18H1G321AF
Description
GDDR3 Graphics RAM 1-Gbit GDDR3 Graphics RAM
Manufacturer
QIMONDA [Qimonda AG]
Datasheet

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6.2
Notes
1. Theta_jA: Junction to Ambient thermal resistance. The values have been obtained by simulation using the conditions stated
2. Theta_jB: Junction to Board thermal resistance. The value has been obtained by simulation.
3. Theta_jC: Junction to Case thermal resistance. The value has been obtained by simulation.
Rev. 0.92, 2007-10
06122007-MW7D-3G3M
JEDEC Board
Air Flow
K/W
in the JEDEC JESD-51 standard.
Package Thermal Characteristics
1s0p
0 m/s
40
1 m/s
32
3 m/s
27
Theta_jA
2s0p
0 m/s
22
43
PG-TFBGA-136 Package Thermal Resistances
1 m/s
19
3 m/s
17
HYB18H1G321AF–10/11/14
Theta_jB
-
5
Internet Data Sheet
TABLE 23
1-Gbit GDDR3
Theta_jC
-
2

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