GS8662S08E GSI [GSI Technology], GS8662S08E Datasheet

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GS8662S08E

Manufacturer Part Number
GS8662S08E
Description
72Mb Burst of 2 DDR SigmaSIO-II SRAM
Manufacturer
GSI [GSI Technology]
Datasheet
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaSIO™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• DLL circuitry for wide output data valid window and future
• Burst of 2 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ mode pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with future 144Mb devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
SigmaRAM™ Family Overview
GS8662S08/09/18/36 are built in compliance with the
SigmaSIO-II SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 75,497,472-bit (72Mb)
SRAMs. These are the first in a family of wide, very low
voltage HSTL I/O SRAMs designed to operate at the speeds
needed to implement economical high performance
networking systems.
Rev: 1.01 9/2005
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
frequency scaling
tKHKH
tKHQV
0.45 ns
3.0 ns
- 333
Parameter Synopsis
DDR SigmaSIO-II SRAM
1/37
0.45 ns
3.3 ns
-300
72Mb Burst of 2
0.45 ns
Clocking and Addressing Schemes
A Burst of 2 SigmaSIO-II SRAM is a synchronous device. It
employs dual input register clock inputs, K and K. The device
also allows the user to manipulate the output register clock
input quasi independently with dual output register clock
inputs, C and C. If the C clocks are tied high, the K clocks are
routed internally to fire the output registers instead. Each Burst
of 2 SigmaSIO-II SRAM also supplies Echo Clock outputs,
CQ and CQ, which are synchronized with read data output.
When used in a source synchronous clocking scheme, the Echo
Clock outputs can be used to fire input registers at the data’s
destination.
Because Separate I/O Burst of 2 RAMs always transfer data in
two packets, A0 is internally set to 0 for the first read or write
transfer, and automatically incremented by 1 for the next
transfer. Because the LSB is tied off internally, the address
field of a Burst of 2 RAM is always one address pin less than
the advertised index depth (e.g., the 4M x 18 has a 1M
addressable index).
4.0 ns
-250
GS8662S08/09/18/36E-333/300/250/200/167
0.45 ns
5.0 ns
-200
1 mm Bump Pitch, 11 x 15 Bump Array
JEDEC Std. MO-216, Variation CAB-1
165-Bump, 15 mm x 17 mm BGA
6.0 ns
0.5 ns
-167
Bottom View
© 2005, GSI Technology
1.8 V and 1.5 V I/O
333 MHz–167 MHz
Preliminary
1.8 V V
DD

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GS8662S08E Summary of contents

Page 1

... GS8662S08/09/18/36 are built in compliance with the SigmaSIO-II SRAM pinout standard for Separate I/O synchronous SRAMs. They are 75,497,472-bit (72Mb) SRAMs. These are the first in a family of wide, very low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems. ...

Page 2

... NW0 controls writes to D0:D3. NW1 controls writes to D4:D7 recommended that H1 be tied low for compatibility with future devices. Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 SigmaQuad SRAM—Top View R/W NW1 ...

Page 3

... Notes controls writes to D0: recommended that H1 be tied low for compatibility with future devices. Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 SigmaQuad SRAM—Top View R ...

Page 4

... BW0 controls writes to D0:D8. BW1 controls writes to D9:D17 recommended that H1 be tied low for compatibility with future devices. Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 SigmaQuad SRAM—Top View R/W BW1 ...

Page 5

... BW2 controls writes to D18:D26. BW3 controls writes to D27:D35 recommended that H1 be tied low for compatibility with future devices. Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 SigmaQuad SRAM—Top View R/W BW2 ...

Page 6

Pin Description Table Symbol SA Synchronous Address Inputs NC R/W NW0–NW1 BW0–BW1 BW0–BW3 K C TMS TDI TCK TDO V HSTL Input Reference Voltage REF ZQ Output Impedance Matching Input OFF ...

Page 7

... SigmaQuad version of the device. SigmaCIO SRAMs offer this same advantage, but do not have the separate Data In and Data Out pins offered on the SigmaSIO SRAMs. Therefore, SigmaSIO devices are useful in psuedo dual port SRAM applications where communication of burst traffic between two electrically independent busses is desired. Each of the three SigmaQuad Family SRAMs— ...

Page 8

... Power-Up Sequence for SigmaQuad-II SRAMs SigmaQuad-II SRAMs must be powered- specific sequence in order to avoid undefined operations. Power-Up Sequence 1. Power-up and maintain Doff at low state. 1a. Apply 1b. Apply V . DDQ 1c. Apply V (may also be applied at the same time as V REF 2. After power is achieved and clocks ( are stablized, change Doff to high. ...

Page 9

... Unchanged Output Register Control SigmaSIO-II SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K and K clocks ...

Page 10

Example Four Bank Depth Expansion Schematic – – Bank ...

Page 11

... CQ Bank 1 CQ Bank 1 C Bank 2 C Bank 2 Q Bank 2 CQ Bank 2 CQ Bank 2 Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 Burst of 2 SigmaSIO-II SRAM Depth Expansion Write D Read E Write B+1 D+1 D ...

Page 12

... HSTL I/O SigmaSIO-II SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to V via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be 5X the value of the intended line impedance driven by the SRAM. The allowable range guarantee impedance matching with a vendor-specified tolerance is between 150Ω ...

Page 13

Byte Write Clock Truth Table ↑ ↑ n+1 n Notes: 1. “1” = input “high”; “0” = input “low”; “X” = input “don’t ...

Page 14

Byte Write Enable (BWn) Truth Table BW3 BW2 BW1 BW0 ...

Page 15

LOAD LOAD READ DDR Read Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 State Diagram Power-Up LOAD NOP LOAD Load New WRITE DDR Write 15/37 Preliminary LOAD LOAD © 2005, GSI ...

Page 16

Absolute Maximum Ratings (All voltages reference Symbol Description V Voltage Voltage in V DDQ V Voltage in V REF V Voltage on I/O Pins I/O V Voltage on Other Input Pins IN ...

Page 17

HSTL I/O DC Input Characteristics Parameter DC Input Logic High DC Input Logic Low Note: Compatible with both 1.8 V and 1.5 V I/O drivers HSTL I/O AC Input Characteristics Parameter AC Input Logic High AC Input Logic Low V ...

Page 18

Capacitance 3 Parameter Input Capacitance Output Capacitance Note: This parameter is sample tested. AC Test Conditions Parameter Input high level Input low level Max. ...

Page 19

Programmable Impedance HSTL Output Driver DC Electrical Characteristics Parameter Output High Voltage Output Low Voltage Output High Voltage Output Low Voltage Notes /2) / (RQ/5) +/– 15 DDQ /2) ...

Page 20

Operating Currents Parameter Symbol I Operating Current (x36): DDR DD I Operating Current (x18): DDR DD I Operating Current (x9): DDR DD I Operating Current (x8): DDR DD I Standby Current (NOP): DDR SB1 All Inputs Notes: 1. Power measured ...

Page 21

AC Electrical Characteristics Parameter Symbol Clock K, K Clock Cycle Time C, C Clock Cycle Time tTKC Variable K, K Clock High Pulse Width C, C Clock High Pulse Width K, K Clock Low Pulse Width C, C Clock Low ...

Page 22

... To avoid bus contention given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus conten- tion because tCHQX1 is a MIN parameter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX parameter (worst case at 70°C, 1.7 V not possible for two SRAMs on the same board such different voltages and tempera- tures. ...

Page 23

K Controlled Read-First Timing Diagram Read A KHKL KHKL KHKH KHKH KLKH KLKH K K AVKH KHAX Address A IVKH LD IVKH R/W BWx Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For ...

Page 24

K Controlled Write-First Timing Diagram NOP K K Address IVKH LD R/W BWx D Q KHCQX KHCQV CQ CQ Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 Write A Read B ...

Page 25

C Controlled Read-First Timing Diagra Read A KHKL KHKL KHKH KHKH KLKH KLKH K K AVKH KHAX Address A IVKH KHIX LD R/W BWx D KHCH CHCL CHCL Rev: 1.01 9/2005 Specifications cited are subject ...

Page 26

C Controlled Write-First Timing Diagram NOP K K Addr IVKH LD R/W BWx JTAG Port Operation Overview The JTAG Port on this RAM operates in a manner that is compliant with the current IEEE ...

Page 27

JTAG Pin Descriptions Pin Pin Name I/O Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate TCK Test Clock In from the falling edge of TCK. The TMS input is sampled ...

Page 28

TDI TMS TCK Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded ...

Page 29

When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. ...

Page 30

TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR ...

Page 31

... Input Low Voltage Output High Voltage (I OH Output Low Voltage (I OL Note: The input level of SRAM pin is to follow the SRAM DC specification. Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 Description Symbol ...

Page 32

... Input and Output Timing Reference Level Notes: 1. Distributed scope and test jig capacitance. 2. Test conditions as shown unless otherwise noted. TCK TDI TMS TDO Parallel SRAM input Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 Symbol TR/TF ...

Page 33

... TMS Input Hold Time TDI Input Setup Time TDI Input Hold Time SRAM Input Setup Time SRAM Input Hold Time Clock Low to Output Valid Rev: 1.01 9/2005 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8662S08/09/18/36E-333/300/250/200/167 Symbol Min ...

Page 34

Package Dimensions—165-Bump FPBGA (Package E) A1 CORNER TOP VIEW SEATING PLANE C Rev: 1.01 ...

Page 35

... Ordering Information—GSI SigmaSIO-II SRAM 1 Org Part Number GS8662S36E-333 GS8662S36E-300 GS8662S36E-250 GS8662S36E-200 GS8662S36E-167 GS8662S36E-333I GS8662S36E-300I GS8662S36E-250I GS8662S36E-200I GS8662S36E-167I GS8662S18E-333 GS8662S18E-300 GS8662S18E-250 GS8662S18E-200 GS8662S18E-167 GS8662S18E-333I ...

Page 36

... Ordering Information—GSI SigmaSIO-II SRAM 1 Org Part Number GS8662S09E-167I GS8662S08E-333 GS8662S08E-300 GS8662S08E-250 GS8662S08E-200 GS8662S08E-167 GS8662S08E-333I GS8662S08E-300I GS8662S08E-250I GS8662S08E-200I GS8662S08E-167I GS8662S36GE-333 GS8662S36GE-300 GS8662S36GE-250 GS8662S36GE-200 GS8662S36GE-167 GS8662S36GE-333I ...

Page 37

... Ordering Information—GSI SigmaSIO-II SRAM 1 Org Part Number GS8662S18GE-167I GS8662S09GE-333 GS8662S09GE-300 GS8662S09GE-250 GS8662S09GE-200 GS8662S09GE-167 GS8662S09GE-333I GS8662S09GE-300I GS8662S09GE-250I GS8662S09GE-200I GS8662S09GE-167I GS8662S08GE-333 GS8662S08GE-300 GS8662S08GE-250 GS8662S08GE-200 GS8662S08GE-167 ...

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