LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 101

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LPC1114FHN33/302

Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1114FHN33/302

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FHN33/302
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
LPC1114FHN33/302
0
Company:
Part Number:
LPC1114FHN33/302
Quantity:
35
Company:
Part Number:
LPC1114FHN33/302
Quantity:
260
Part Number:
LPC1114FHN33/302:5
Manufacturer:
Intersil
Quantity:
419
Part Number:
LPC1114FHN33/302:5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
13. Soldering
LPC111X
Product data sheet
Fig 58. Reflow soldering of the SO20 package
solder lands
occupied area
placement accuracy ± 0.25
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 20 February 2013
13.40
0.60 (20×)
LPC1110/11/12/13/14/15
Dimensions in mm
1.27 (18×)
1.50
8.00
11.00
32-bit ARM Cortex-M0 microcontroller
11.40
sot163-1_fr
© NXP B.V. 2013. All rights reserved.
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