LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 54

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LPC1114FHN33/302

Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1114FHN33/302

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L

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NXP Semiconductors
LPC111X
Product data sheet
CAUTION
7.17.5 APB interface
7.17.6 AHBLite
7.17.7 External interrupt inputs
7.18 Emulation and debugging
In addition to the three CRP levels, sampling of pin PIO0_1 for valid user code can be
disabled. For details see the LPC111x user manual.
The APB peripherals are located on one APB bus.
The AHBLite connects the CPU bus of the ARM Cortex-M0 to the flash memory, the main
static RAM, and the Boot ROM.
All GPIO pins can be level or edge sensitive interrupt inputs. In addition, start logic inputs
serve as external interrupts (see
Debug functions are integrated into the ARM Cortex-M0. Serial wire debug with four
breakpoints and two watchpoints is supported.
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 20 February 2013
Section
LPC1110/11/12/13/14/15
7.17.1).
32-bit ARM Cortex-M0 microcontroller
© NXP B.V. 2013. All rights reserved.
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