LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 91

• Manufacturer Part Number: LPC1114FHN33/302
• Description: ARM Microcontrollers - MCU 32b 32K Flash 42I/O
• Manufacturer: NXP Semiconductors

Specifications of LPC1114FHN33/302

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1114
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 8 KB
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Interface Type: I2C, SPI, SSP, UART
• Maximum Operating Temperature: + 85 C
• Number Of Programmable I/os: 42
• Number Of Timers: 4
• Program Memory Type: Flash
• Factory Pack Quantity: 260
• Tradename: LPC1100L

NXP Semiconductors
LPC111X
Product data sheet
11.7 ElectroMagnetic Compatibility (EMC)
Radiated emission measurements according to the IEC61967-2 standard using the
TEM-cell method are shown for the LPC1114FBD48/302 in
Table 28.
V
[1]
Parameter
Input clock: IRC (12 MHz)
maximum
peak level
Input clock: crystal oscillator (12 MHz)
maximum
peak level
IEC level
IEC level
DD
= 3.3 V; T
IEC levels refer to Appendix D in the IEC61967-2 Specification.
[1]
[1]
ElectroMagnetic Compatibility (EMC) for part LPC1114FBD48/302 (TEM-cell
method)
amb
Frequency band
150 kHz to 30 MHz
30 MHz to 150 MHz
150 MHz to 1 GHz
-
150 kHz to 30 MHz
30 MHz to 150 MHz
150 MHz to 1 GHz
-
All information provided in this document is subject to legal disclaimers.
= 25

C.
Rev. 8 — 20 February 2013
System clock =
12 MHz
7
2
4
O
7
2
4
O
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
24 MHz
5
1
8
N
7
1
7
N
Table
28.
48 MHz
M
14
M
7
10
16
7
8
© NXP B.V. 2013. All rights reserved.
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Unit
dBV
dBV
dBV
-
dBV
dBV
dBV
-