LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 73

• Manufacturer Part Number: LPC1114FHN33/302
• Description: ARM Microcontrollers - MCU 32b 32K Flash 42I/O
• Manufacturer: NXP Semiconductors

Specifications of LPC1114FHN33/302

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1114
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 8 KB
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Interface Type: I2C, SPI, SSP, UART
• Maximum Operating Temperature: + 85 C
• Number Of Programmable I/os: 42
• Number Of Timers: 4
• Program Memory Type: Flash
• Factory Pack Quantity: 260
• Tradename: LPC1100L

NXP Semiconductors
LPC111X
Product data sheet
Fig 30. Deep-sleep mode: Typical supply current I
Fig 31. Deep power-down mode: Typical supply current I
(μA)
(μA)
I
I
DD
DD
5.5
4.5
3.5
2.5
1.5
0.8
0.6
0.4
0.2
Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register
(PDSLEEPCFG = 0x0000 18FF).
supply voltages V
different supply voltages V
0
−40
−40
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 20 February 2013
−15
−15
DD
(for LPC111x/103/203/303/323/333)
V
DD
= 3.3 V, 3.6 V
DD
10
10
(for LPC111x/103/203/303/323/333)
LPC1110/11/12/13/14/15
1.8 V
32-bit ARM Cortex-M0 microcontroller
35
DD
35
versus temperature for different
DD
V
DD
versus temperature for
= 3.6 V
3.3 V
1.8 V
60
60
temperature (°C)
temperature (°C)
© NXP B.V. 2013. All rights reserved.
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