LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 105

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LPC1114FHN33/302

Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1114FHN33/302

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FHN33/302
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
LPC1114FHN33/302
0
Company:
Part Number:
LPC1114FHN33/302
Quantity:
35
Company:
Part Number:
LPC1114FHN33/302
Quantity:
260
Part Number:
LPC1114FHN33/302:5
Manufacturer:
Intersil
Quantity:
419
Part Number:
LPC1114FHN33/302:5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC111X
Product data sheet
Fig 62. Reflow soldering of the HVQFN33 package (5x5)
Footprint information for reflow soldering of HVQFN33 package
Issue date
Dimensions in mm
0.5
P
solder land
solder paste
occupied area
5.95
Ax
11-11-15
11-11-20
5.95
Ay
4.25
Bx
see detail X
Hy
4.25
By
Gy
SLy
C
0.85
C
All information provided in this document is subject to legal disclaimers.
0.27
D
Rev. 8 — 20 February 2013
5.25
Gx
nSPx
5.25
Gy
SLx
Hx
Gx
Bx
Ax
6.2
Hx
D
nSPy
LPC1110/11/12/13/14/15
P
6.2
Hy
3.75
32-bit ARM Cortex-M0 microcontroller
SLx
By
3.75
SLy
Ay
nSPx
3
nSPy
detail X
3
© NXP B.V. 2013. All rights reserved.
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0.60
002aag766
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