MCIMX255AJM4AR2 Freescale Semiconductor, MCIMX255AJM4AR2 Datasheet - Page 10

• Manufacturer Part Number: MCIMX255AJM4AR2
• Description: Processors - Application Specialized IMX25 1.2 AUTO
• Manufacturer: Freescale Semiconductor

Specifications of MCIMX255AJM4AR2

• Core: ARM926EJ-S
• Processor Series: MCIMX25
• Maximum Clock Frequency: 400 MHz
• Instruction / Data Cache Memory: 16 KB
• Data Ram Size: 128 KB
• Operating Supply Voltage: 1.15 V to 1.52 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-400
• Interface Type: USB
• Memory Type: DDR2
• Minimum Operating Temperature: - 40 C

10
MESH_C, MESH_D Wire-mesh tamper detect pins that can be routed at the PCB board to detect attempted tampering of a
USBPHY1_RREF
OSC32K_EXTAL
NVCC_DRYICE
UPLL_BYPCLK
OSC32K_XTAL
USBPHY2_DM
USBPHY2_DP
POWER_FAIL
TEST_MODE
TAMPER_A,
TAMPER _B
SJC_MOD
OSC_BYP
Signal
REF
protected wire. When security measures are implemented, MESH_C should be pulled-up or connected to
NVCC_DRYICE and triggers a tamper event when floating or when connected to MESH_D. MESH_D
should be pulled-down or connected to GND and triggers an event when floating or connected to
MESH_C. These pins can be left unconnected if the DryIce security features are not being used.
This is the DryIce power supply output. The supply source is QVDD when the i.MX25 is in run mode.
When i.MX25 is in reduced power mode, the DryIce supply source is the BATT_VDD supply. This pin can
be used to power external DryIce components (external tamper detect, wire-mesh tamper detect). In
order to guarantee the power-loss protection feature which guarantees that RTC and/or secure keys be
maintained after power-off an external capacitor no less than 4 µF must be connected to this supply output
pin. A 4.7 µF capacitor is recommended.
The 32 kHz oscillator bypass-control pin. If this signal is pulled down, then OSC32K_EXTAL and
OSC32K_XTAL analog pins should be tied to the external 32.768 kHz crystal circuit. If on the other hand
the signal is pulled up, then the external 32 kHz oscillator output clock must be connected to
OSC32K_EXTAL analog pin, and OSC32K_XTAL can be no connect (NC).
These analog pins are connected to an external 32 kHz CLK circuit depending on the state of OSC_BYP
pin (see the description of OSC_BYP under the preceding bullet). The 32 kHz reference CLK is required
for normal operation.
An interrupt from PMIC, which should be connected to a low-battery detection circuit. This signal is
internally connected to an on-chip 100 k pull-down device. If there is no low-battery detection, then users
can tie this pin to GND through a pull-down resistor, or leave the signal as NC. This pin can also be
configured to work as a normal GPIO.
External ADC reference voltage. REF may be tied to GND if the user plans to only use the internally
generated 2.5 V reference supply.
Must be externally connected to GND for normal operation. Termination to GND through an external
pull-down resistor (such as 1 k ) is allowed, but the value should be much smaller than the on-chip 100
k
DryIce external tamper detect pins, active high. If TAMPER_A or TAMPER_B is connected to
NVCC_DRYICE, then external tampering is detected. These pins can be left unconnected if the DryIce
security features are not being used.
For Freescale factory use only. This signal is internally connected to an on-chip pull-down device. Users
must either float this signal or tie it to GND.
Primarily for Freescale factory use. There is no internal on-chip pull-up/down on this pin, so it must be
externally connected to GND or VDD. Aside from factory use, this pin can also be configured (through
muxing) to work as a normal GPIO.
Determines the reference current for the USB PHY1 bandgap reference. An external 10 k 1% resistor to
GND is required.
The output impedance of these signals is expected at 10 . It is recommended to also have on-board 33
series resistors (close to the pins).
pull-up.
i.MX25 Applications Processor for Automotive Products, Rev. 9
Table 4. Signal Considerations (continued)
Description
Freescale Semiconductor