PSMN009-100B /T3 NXP Semiconductors, PSMN009-100B /T3 Datasheet - Page 4

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PSMN009-100B /T3

Manufacturer Part Number
PSMN009-100B /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PSMN009-100B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
75 A
Resistance Drain-source Rds (on)
0.0088 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
43 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
230 W
Rise Time
59 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
120 ns
Part # Aliases
PSMN009-100B,118
NXP Semiconductors
PSMN009-100B_2
Product data sheet
Fig 3.
(A)
I
D
10
10
10
1
3
2
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
1
Limit R
DSon
= V
DS
/I
D
10
DC
Rev. 02 — 6 July 2009
N-channel TrenchMOS SiliconMAX standard level FET
10
2
t
100 µs
1 ms
10 ms
100 ms
p
= 10 µs
PSMN009-100B
V
DS
(V)
© NXP B.V. 2009. All rights reserved.
03ai01
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