AT25DF081-SSHN-B Atmel, AT25DF081-SSHN-B Datasheet - Page 34

IC FLASH 8MBIT 66MHZ 8SOIC

AT25DF081-SSHN-B

Manufacturer Part Number
AT25DF081-SSHN-B
Description
IC FLASH 8MBIT 66MHZ 8SOIC
Manufacturer
Atmel
Datasheet

Specifications of AT25DF081-SSHN-B

Format - Memory
FLASH
Memory Type
DataFLASH
Memory Size
8M (4096 pages x 256 bytes)
Speed
66MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
1.65 V ~ 1.95 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Cell Type
NOR
Density
8Mb
Access Time (max)
7ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
1.8V
Operating Temp Range
-40C to 85C
Package Type
SOIC
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.65V
Operating Supply Voltage (max)
1.95V
Supply Current
12mA
Mounting
Surface Mount
Pin Count
8
Architecture
Sectored
Supply Voltage (max)
1.95 V
Supply Voltage (min)
1.65 V
Maximum Operating Current
12 mA
Mounting Style
SMD/SMT
Organization
64 KB x 16
Memory Configuration
4096 Pages X 256 Bytes
Clock Frequency
66MHz
Supply Voltage Range
1.65V To 1.95V
Memory Case Style
SOIC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT25DF081-SSHN-B
Manufacturer:
ATMEL
Quantity:
4 300
14.3
14.4
Notes:
34
AT25DF081-WDT20N
AT25DF081-WDT11N
AT25DF081-WBT11N
Atmel Designator
Ordering Code
Product Family
Device Density
Ordering Code Detail – Wafer Level Options
Green Package Options (Pb/Halide-free/RoHS Compliant)
1. Die/wafer carrier option code is not marked on devices.
2. Please contact Atmel for minimum order requirements for bare die and bumped die options.
AT25DF081
08 = 8-megabit
Interface
1 = Serial
Bumped Die
Package
Bare Die
A T 2 5 D
Lead Finish
F
Sn-Ag
n/a
0 8
1 –
W B T
Operating Voltage
1.65V to 1.95V
1 1
N
Operating Voltage
N = 1.65V minimum (1.65V to 1.95V)
Die/Wafer Backgrind Thickness
20 = 20mils
11 = 11mils
Die/Wafer Carrier Option
T = Tape and reel
Wafer Level Option
WD = Bare die
WB = Bumped die, Pb-Free
f
SCK
66
(MHz)
Operation Range
(-40°C to +85°C)
3674E–DFLASH–8/08
Industrial

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