STEVAL-IFW001V1 STMicroelectronics, STEVAL-IFW001V1 Datasheet - Page 98

• Manufacturer Part Number: STEVAL-IFW001V1
• Description: BOARD EVAL BASED ON STR912FA
• Manufacturer: STMicroelectronics

Specifications of STEVAL-IFW001V1

• Design Resources: STEVAL-IFW001V1 Gerber Files STEVAL-IFW001V1 Schematic STEVAL-IFW001V1 Bill of Material
• Main Purpose: Interface, Ethernet
• Embedded: Yes, MCU, 32-Bit
• Utilized Ic / Part: E-STE101P, STR912FAW44
• Primary Attributes: Dual Ethernet Transceivers for Full Duplex Communication
• Secondary Attributes: Up to 32 MII Addresses, UART, I2C, SPI, with RJ45 Connectors
• Silicon Manufacturer: ST Micro
• Core Architecture: ARM
• Core Sub-architecture: ARM9
• Silicon Core Number: STR9
• Silicon Family Name: STR91x
• For Use With: 497-8263 - BOARD EXTENSION STEVAL-IFW001V1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8262

Package mechanical data
9.1
9.2
98/102
Figure 43. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
ECOPACK
To meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions, and product status are available at www.st.com.
Thermal characteristics
The average chip-junction temperature, T
The average chip-junction temperature, T
following equation:
Where:
●
●
●
●
P
Most of the time for the applications P
P
and/or memories. The worst case P
2.0 V).
An approximate relationship between P
Therefore (solving equations 1 and 2):
Where:
●
I/O
I/O
represents the power dissipation on input and output pins;
may be significant if the device is configured to drive continuously external modules
T
Θ
P
P
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
and T
A
JA
D
INT
is the ambient temperature in ° C,
is the sum of P
is the package junction-to-ambient thermal resistance, in ° C/W,
is the product of I
J
may be obtained by solving equations (1) and (2) iteratively for any value of T
T
P
K = P
J
D
Dpad
Dsm
= T
D
= K / (T
(at equilibrium) for a known T
D
A
x (T
+ (P
INT
J
A
D
and P
+ 273 °C)
DD
+ 273 °C) + Θ
x Θ
and V
Doc ID 13495 Rev 6
JA
I/O
)
INT
(P
DD
I/O
D
, expressed in Watts. This is the Chip Internal Power.
of the STR91xFA is 500 mW (I
D
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
= P
< P
JA
J
and T
J
, in degrees Celsius, may be calculated using the
must never exceed 125 °C.
INT
INT
x P
+ P
D
J
and may be neglected. On the other hand,
2
(if P
A.
I/O
Using this value of K, the values of P
I/O
),
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
(1)
(2)
(3)
is neglected) is given by:
DD
x V
DD
STR91xFAxxx
, or 250 mA x
D
A
.