MPC564MZP56 Freescale Semiconductor, MPC564MZP56 Datasheet - Page 121

• Manufacturer Part Number: MPC564MZP56
• Description: IC MCU 512K FLASH 56MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP56

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• Core: PowerPC
• Processor Series: MPC5xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 56 MHz
• Data Ram Size: 32 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 56
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 5 V
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 32
• Height: 1.95 mm
• Interface Type: CAN, JTAG, QSPI, SCI, SPI, UART
• Length: 27 mm
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 2.7 V, 5.25 V
• Supply Voltage (min): 2.5 V, 4.75 V
• Width: 27 mm
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

2.4
The PDMCR2 controls alternate functionality of signals shared between different modules, as well as the
pre-discharge circuitry to allow 5V friendliness on the data bus.
Freescale Semiconductor
1
15-31
HRESET
HRESET
9:14
Bits
This bit was RESERVED on the K27S mask set of MPC561.
6
7
8
Field PREDIS_ EN
Addr
Field
Pad Module Configuration Register (PDMCR2)
T2CLK_PU Controls the pull-up on the TPU T2CLK signals.
PULL_DIS
SPRDS
PRDS
Name
—
PPMV
MSB
16
0
Disables weak pull-up/pull down devices enabled at the assertion of PORESET/TRST or
HRESET.
Signals affected by the PRDS bit include the following:
0 Enable weak pull-up/pull down devices on pads controlled by this signal.
1 Disable weak pull-up/pull down devices on pads controlled by this signal.
Refer to
Disables weak pull-up/pull down devices enabled at the assertion of PORESET/TRST or
HRESET.
Signals affected by the SPRDS bit include the following: BDIP, TA, TS, TEA, RD/WR, BR, BG, BB,
TSIZ, BI/STS, BURST, TDI, TMS, JCOMP, TCK.
0 Enable weak pull-up/pull down devices on pads controlled by this signal.
1 Disable weak pull-up/pull down devices on pads controlled by this signal.
Refer to
0 Pull-ups are enabled if the T2CLK signals are defined as inputs
1 Pull-ups are disabled on the T2CLK signals
Disables weak pull up-or-down devices enabled at the assertion of PORESET/TRST or HRESET.
Signals affected by these bits include the following:
0 Enable weak pull-up/pull-down devices on pads controlled by this signal.
1 Disable weak pull-up/pull-down devices on pads controlled by this signal.
Reserved
• all SGPIO signals
• all TPU3 signals
• PULL_DIS0 (bit 9): all MIOS14 input signals
• PULL_DIS1 (bit 10): all QSMCM input signals
• PULL_DIS2 (bit 11): all QADC64E input signals, except ETRIG1 and ETRIG2
• PULL_DIS3 (bit 12): all TouCAN input signals
• PULL_DIS4 (bit 13): Reserved
• PULL_DIS5 (bit 14): ETRIG1 and ETRIG2
Figure 2-3. Pads Module Configuration Register 2 (PDMCR2)
17
1
Table 2-5. PDMCR Field Descriptions (continued)
Table 2-14
Table 2-14
—
—
18
2
MPC561/MPC563 Reference Manual, Rev. 1.2
19
3
MDO6 MPI6
for more information on PRDS.
for more information on SPRDS.
20
4
TCNC
21
5
0000_0000_0000_0000
0000_0000_0000_0000
MPI7 MPI8 MPI9
22
6
0x2F C038
Description
—
23
7
1
24
8
PC
SV
25
9
—
PCS
4EN
10
26
PCS
5EN
11
27
PPMPAD
PCS
6EN
12
28
PCS
7EN
13
29
Signal Descriptions
14
30
—
—
LSB
15
31
2-23