MPC564MZP56 Freescale Semiconductor, MPC564MZP56 Datasheet - Page 37

• Manufacturer Part Number: MPC564MZP56
• Description: IC MCU 512K FLASH 56MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP56

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• Core: PowerPC
• Processor Series: MPC5xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 56 MHz
• Data Ram Size: 32 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 56
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 5 V
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 32
• Height: 1.95 mm
• Interface Type: CAN, JTAG, QSPI, SCI, SPI, UART
• Length: 27 mm
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 2.7 V, 5.25 V
• Supply Voltage (min): 2.5 V, 4.75 V
• Width: 27 mm
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

D.20.1.1
D.20.1.2
D.20.1.3
D.20.1.4
D.20.1.5
D.20.1.6
D.20.2
D.20.3
D.20.3.1
D.20.3.2
D.20.3.3
F.1
F.2
F.2.1
F.2.2
F.2.3
F.3
F.3.1
F.4
F.5
F.6
F.7
F.8
F.8.1
F.8.2
F.9
F.9.1
F.9.2
F.10
F.10.1
F.11
F.12
F.13
Freescale Semiconductor
Paragraph
Number
Package ............................................................................................................................ F-2
EMI Characteristics ......................................................................................................... F-2
Thermal Characteristics ................................................................................................... F-3
ESD Protection ................................................................................................................ F-6
DC Electrical Characteristics........................................................................................... F-7
Oscillator and PLL Electrical Characteristics................................................................ F-11
Flash Electrical Characteristics...................................................................................... F-12
Power-Up/Down Sequencing......................................................................................... F-13
Issues Regarding Power Sequence ................................................................................ F-17
AC Timing ..................................................................................................................... F-18
READI Electrical Characteristics .................................................................................. F-45
RESET Timing............................................................................................................... F-47
IEEE 1149.1 Electrical Characteristics.......................................................................... F-50
Host RCPU Initialization of the SIOP Function....................................................... D-57
SIOP Function Performance ..................................................................................... D-57
Reference Documents .................................................................................................. F-2
Definitions and Acronyms ........................................................................................... F-3
EMI Testing Specifications.......................................................................................... F-3
Thermal References ..................................................................................................... F-5
Power-Up/Down Option A ........................................................................................ F-13
Power-Up/Down Option B ........................................................................................ F-15
Application of PORESET or HRESET ..................................................................... F-17
Keep-Alive RAM....................................................................................................... F-18
Debug Port Timing .................................................................................................... F-43
CHAN_CONTROL .............................................................................................. D-56
BIT_D ................................................................................................................... D-56
HALF_PERIOD ................................................................................................... D-56
BIT_COUNT ........................................................................................................ D-56
XFER_SIZE.......................................................................................................... D-56
SIOP_DATA ......................................................................................................... D-57
XFER_SIZE Greater Than 16 .............................................................................. D-58
Data Positioning.................................................................................................... D-58
Data Timing .......................................................................................................... D-58
MPC561/MPC563 Reference Manual, Rev. 1.2
Electrical Characteristics
Memory Access Timing
Contents
Appendix E
Appendix F
Title
Number
Page
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