MT46H16M32LFCM-6:B Micron Technology Inc, MT46H16M32LFCM-6:B Datasheet - Page 86

• Manufacturer Part Number: MT46H16M32LFCM-6:B
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H16M32LFCM-6:B

• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 115mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Figure 46: Bank Read – Without Auto Precharge
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Case 2:
Case 1:
Command
BA0, BA1
Address
DQ
DQ
DQS
DQS
t
t
AC (MAX) and
CK#
CKE
A10
DM
AC (MIN) and
CK
7,8
7,8
7
7
t
t
IS
IS
NOP
T0
t
t
DQSCK (MIN)
DQSCK (MAX)
t
t
1
IH
IH
Notes:
t
ACTIVE
Bank x
IS
t
IS
Row
Row
T1
t
IH
t
IH
1. NOP commands are shown for ease of illustration; other commands may be valid at
2. BL = 4 in the case shown.
3. PRE = PRECHARGE.
4. Disable auto precharge.
5. Bank x at T5 is “Don’t Care” if A10 is HIGH at T5.
6. The PRECHARGE command can only be applied at T5 if
7. Refer to Figure 30 (page 68) and Figure 31 (page 69) for DQS and DQ timing details.
8. D
t
CK
t
t
t
RCD
RAS
RC
these times.
OUT
NOP
6
T2
n = data out from column n.
1
t
CH
t
CL
Bank x
READ
t
Note 4
t
Col n
IS
LZ (MIN)
T3
t
2
IH
CL = 2
t
RPRE
t
t
AC (MIN)
LZ (MIN)
NOP
T4
86
1
t
AC (MAX)
D
t
512Mb: x16, x32 Mobile LPDDR SDRAM
OUT
RPRE
t
One bank
DQSCK (MIN)
All banks
Bank x
D
Micron Technology, Inc. reserves the right to change products or specifications without notice.
PRE
OUT
T5
D
t
OUT
DQSCK (MAX)
3
5
D
T5n
OUT
D
OUT
D
NOP
t
OUT
T6
RPST
D
OUT
Don’t Care
1
t
RP
T6n
t
HZ (MAX)
D
t
RPST
OUT
t
RAS (MIN) is met.
NOP
T7
© 2004 Micron Technology, Inc. All rights reserved.
1
Transitioning Data
Auto Precharge
ACTIVE
Bank x
Row
Row
T8