MT48LC16M16A2P-7E:D Micron Technology Inc, MT48LC16M16A2P-7E:D Datasheet - Page 35

• Manufacturer Part Number: MT48LC16M16A2P-7E:D
• Description: SDRAM 256MB, SMD, 48LC16, TSOP54
• Manufacturer: Micron Technology Inc
• Type: SDRAMr
• Series: -r

Specifications of MT48LC16M16A2P-7E:D

• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 5.4ns
• Maximum Clock Rate: 143MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Access Time: RoHS Compliant
• Memory Case Style: TSOP
• No. Of Pins: 54
• Operating Temperature Range: 0°C To +70°C
• Operating Temperature Max: 70°C
• Operating Temperature Min: 0°C
• Package / Case: TSOP
• Memory Type: DRAM - Synchronous
• Memory Configuration: 4 BLK (4M X 16)
• Interface Type: LVTTL
• Rohs Compliant: Yes
• Format - Memory: RAM
• Memory Size: 256M (16Mx16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

READ with Auto Precharge
WRITE with Auto Precharge
Figure 29:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. M 10/07 EN
READ With Auto Precharge Interrupted by a READ
Note:
• Interrupted by a READ (with or without auto precharge): A READ to bank m will inter-
• Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will
• Interrupted by a READ (with or without auto precharge): A READ to bank m will inter-
• Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will
Internal
States
rupt a READ on bank n, CL later. The precharge to bank n will begin when the READ
to bank m is registered (Figure 29 on page 35).
interrupt a READ on bank n when registered. DQM should be used two clocks prior to
the WRITE command to prevent bus contention. The precharge to bank n will begin
when the WRITE to bank m is registered (Figure 30 on page 36).
rupt a WRITE on bank n when registered, with the data-out appearing CL later. The
precharge to bank n will begin after
bank m is registered. The last valid WRITE to bank n will be data-in registered one
clock prior to the READ to bank m (Figure 31 on page 36).
interrupt a WRITE on bank n when registered. The precharge to bank n will begin
after
valid data WRITE to bank n will be data registered one clock prior to a WRITE to bank
m (Figure 32 on page 37).
DQM is LOW.
t
WR is met, where
COMMAND
ADDRESS
BANK m
BANK n
CLK
DQ
Page Active
T0
NOP
t
WR begins when the WRITE to bank m is registered. The last
READ - AP
BANK n,
Page Active
BANK n
COL a
T1
35
READ with Burst of 4
CAS Latency = 3 (BANK n)
T2
NOP
t
Micron Technology, Inc., reserves the right to change products or specifications without notice.
WR is met, where
BANK m,
READ - AP
T3
BANK m
COL d
Interrupt Burst, Precharge
CAS Latency = 3 (BANK m)
READ with Burst of 4
TRANSITIONING DATA
T4
NOP
D
64Mb: x4, x8, x16 SDRAM
OUT
a
t
RP - BANK n
t
WR begins when the READ to
T5
NOP
D
a + 1
©2000 Micron Technology, Inc. All rights reserved.
OUT
T6
NOP
D
OUT
d
Commands
DON’T CARE
Idle
T7
NOP
t RP - BANK m
Precharge
D
d + 1
OUT