MC9S08SH4CTG Freescale, MC9S08SH4CTG Datasheet - Page 17

• Manufacturer Part Number: MC9S08SH4CTG
• Manufacturer: Freescale

Specifications of MC9S08SH4CTG

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 256Byte
• # I/os (max): 13
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Program Memory Type: Flash
• Program Memory Size: 4KB
• Lead Free Status / RoHS Status: Compliant

Section Number
17.3 On-Chip Debug System (DBG) ....................................................................................................277
17.4 Register Definition ........................................................................................................................281
A.1 Introduction ...................................................................................................................................289
A.2 Parameter Classification ................................................................................................................289
A.3 Absolute Maximum Ratings ..........................................................................................................289
A.4 Thermal Characteristics .................................................................................................................291
A.5 ESD Protection and Latch-Up Immunity ......................................................................................293
A.6 DC Characteristics .........................................................................................................................294
A.7 Supply Current Characteristics ......................................................................................................298
A.8 External Oscillator (XOSC) Characteristics .................................................................................301
A.9 Internal Clock Source (ICS) Characteristics .................................................................................303
A.10 Analog Comparator (ACMP) Electricals ......................................................................................305
A.11 ADC Characteristics ......................................................................................................................306
A.12 AC Characteristics .........................................................................................................................309
A.13 FLASH Specifications ...................................................................................................................315
A.14 EMC Performance .........................................................................................................................316
B.1 Ordering Information ....................................................................................................................319
B.2 Mechanical Drawings ....................................................................................................................320
Freescale Semiconductor
17.2.2 Communication Details ..................................................................................................270
17.2.3 BDC Commands .............................................................................................................274
17.2.4 BDC Hardware Breakpoint .............................................................................................276
17.3.1 Comparators A and B ......................................................................................................277
17.3.2 Bus Capture Information and FIFO Operation ...............................................................277
17.3.3 Change-of-Flow Information ..........................................................................................278
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................278
17.3.5 Trigger Modes .................................................................................................................279
17.3.6 Hardware Breakpoints ....................................................................................................281
17.4.1 BDC Registers and Control Bits .....................................................................................281
17.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................283
17.4.3 DBG Registers and Control Bits .....................................................................................284
A.12.1 Control Timing ...............................................................................................................309
A.12.2 TPM/MTIM Module Timing ..........................................................................................311
A.12.3 SPI ...................................................................................................................................312
A.14.1 Radiated Emissions .........................................................................................................316
A.14.2 Conducted Transient Susceptibility ................................................................................316
B.1.1 Device Numbering Scheme ............................................................................................319
Ordering Information and Mechanical Drawings
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Electrical Characteristics
Appendix A
Appendix B
Title
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