MT46H8M32LFB5-6:H Micron Technology Inc, MT46H8M32LFB5-6:H Datasheet - Page 51

IC SDRAM 256MB 166MHZ 90VFBGA

MT46H8M32LFB5-6:H

Manufacturer Part Number
MT46H8M32LFB5-6:H
Description
IC SDRAM 256MB 166MHZ 90VFBGA
Manufacturer
Micron Technology Inc
Series
-r
Type
DDR SDRAMr
Datasheets

Specifications of MT46H8M32LFB5-6:H

Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
256M (8Mx32)
Speed
166MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
90-VFBGA
Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
6.5/5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
120mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT46H8M32LFB5-6:H
Manufacturer:
ST
Quantity:
34 600
Part Number:
MT46H8M32LFB5-6:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Table 18: Burst Definition Table (Continued)
CAS Latency
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. I 09/10 EN
Length
Burst
Starting Column Address
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
The CAS latency (CL) is the delay, in clock cycles, between the registration of a READ
command and the availability of the first output data. The latency can be set to 2 or 3
clocks, as shown in Figure 18 (page 52).
For CL = 3, if the READ command is registered at clock edge n, then the data will be
nominally available at (n + 2 clocks +
tered at clock edge n, then the data will be nominally available at (n + 1 clock +
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0-1-2-3-4-5-6-7-8-9-A-B-C-D-E-F
1-2-3-4-5-6-7-8-9-A-B-C-D-E-F-0
2-3-4-5-6-7-8-9-A-B-C-D-E-F-0-1
3-4-5-6-7-8-9-A-B-C-D-E-F-0-1-2
4-5-6-7-8-9-A-B-C-D-E-F-0-1-2-3
5-6-7-8-9-A-B-C-D-E-F-0-1-2-3-4
6-7-8-9-A-B-C-D-E-F-0-1-2-3-4-5
7-8-9-A-B-C-D-E-F-0-1-2-3-4-5-6
8-9-A-B-C-D-E-F-0-1-2-3-4-5-6-7
9-A-B-C-D-E-F-0-1-2-3-4-5-6-7-8
A-B-C-D-E-F-0-1-2-3-4-5-6-7-8-9
B-C-D-E-F-0-1-2-3-4-5-6-7-8-9-A
C-D-E-F-0-1-2-3-4-5-6-7-8-9-A-B
D-E-F-0-1-2-3-4-5-6-7-8-9-A-B-C
E-F-0-1-2-3-4-5-6-7-8-9-A-B-C-D
F-0-1-2-3-4-5-6-7-8-9-A-B-C-D-E
Type = Sequential
51
256Mb: x16, x32 Mobile LPDDR SDRAM
Order of Accesses Within a Burst
t
AC). For CL = 2, if the READ command is regis-
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Standard Mode Register
0-1-2-3-4-5-6-7-8-9-A-B-C-D-E-F
1-0-3-2-5-4-7-6-9-8-B-A-D-C-F-E
2-3-0-1-6-7-4-5-A-B-8-9-E-F-C-D
3-2-1-0-7-6-5-4-B-A-9-8-F-E-D-C
4-5-6-7-0-1-2-3-C-D-E-F-8-9-A-B
5-4-7-6-1-0-3-2-D-C-F-E-9-8-B-A
6-7-4-5-2-3-0-1-E-F-C-D-A-B-8-9
7-6-5-4-3-2-1-0-F-E-D-C-B-A-9-8
8-9-A-B-C-D-E-F-0-1-2-3-4-5-6-7
9-8-B-A-D-C-F-E-1-0-3-2-5-4-7-6
A-B-8-9-E-F-C-D-2-3-0-1-6-7-4-5
B-A-9-8-F-E-D-C-3-2-1-0-7-6-5-4
C-D-E-F-8-9-A-B-4-5-6-7-0-1-2-3
D-C-F-E-9-8-B-A-5-4-7-6-1-0-3-2
E-F-C-D-A-B-8-9-6-7-4-5-2-3-0-1
F-E-D-C-B-A-9-8-7-6-5-4-3-2-1-0
Type = Interleaved
© 2008 Micron Technology, Inc. All rights reserved.
t
AC).

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