XC2C32 XILINX [Xilinx, Inc], XC2C32 Datasheet - Page 13

• Manufacturer Part Number: XC2C32
• Description: CoolRunner-II CPLD Family
• Manufacturer: XILINX [Xilinx, Inc]

Absolute Maximum Ratings
Quality and Reliability Parameters
Further Reading
Application Notes
http://direct.xilinx.com/bvdocs/appnotes/xapp375.pdf
(Timing Model)
http://direct.xilinx.com/bvdocs/appnotes/xapp376.pdf
(Logic Engine)
http://direct.xilinx.com/bvdocs/appnotes/xapp377.pdf
(Low Power Design)
http://direct.xilinx.com/bvdocs/appnotes/xapp378.pdf
(Advanced Features)
http://direct.xilinx.com/bvdocs/appnotes/xapp379.pdf
(High Speed Design
http://direct.xilinx.com/bvdocs/appnotes/xapp380.pdf
(Cross Point Switch)
http://direct.xilinx.com/bvdocs/appnotes/xapp381.pdf
(Demo Board)
http://direct.xilinx.com/bvdocs/appnotes/xapp382.pdf
(I/O Characteristics)
http://direct.xilinx.com/bvdocs/appnotes/xapp383.pdf
(Single Error Correction Double Error Detection)
DS090 (v2.5) June 28, 2005
Product Specification
Notes:
1.
2.
3.
4.
Notes:
1.
Symbol
Stresses above those listed may cause malfunction or permanent damage to the device. This is a stress rating only. Functional
operation at these or any other condition above those indicated in the operational and programming specification is not implied.
The chip supply voltage should rise monotonically.
Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0V or overshoot to 4.5 V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA. The I/O voltage may never exceed 4.0V.
For soldering guidelines and thermal considerations, see the
packages, see XAPP427.
ESD is measured to 2000V using the human body model. Pins exposed to this limit can incur additional leakage current to
a maximum of 10 A when driven to 3.9V.
V
T
N
ESD
DR
PE
Symbol
V
T
T
V
CC
STR
J
I
(3)
R
(4)
(2)
Data retention
Program/erase cycles (Endurance)
Electrostatic discharge(1)
)
Supply voltage relative to GND
Input voltage relative to GND
Maximum junction temperature
Storage temperature
Parameter
(1)
Parameter
www.xilinx.com
Device Packaging
http://direct.xilinx.com/bvdocs/appnotes/xapp384.pdf
(DDR SDRAM Interface)
http://direct.xilinx.com/bvdocs/appnotes/xapp387.pdf
(PicoBlaze Microcontroller)
http://direct.xilinx.com/bvdocs/appnotes/xapp388.pdf
(On the Fly Reconfiguration)
http://direct.xilinx.com/bvdocs/appnotes/xapp389.pdf
(Powering CoolRunner-II)
http://direct.xilinx.com/bvdocs/appnotes/xapp393.pdf
(8051 Microcontroller Interface)
http://direct.xilinx.com/bvdocs/appnotes/xapp394.pdf
(Interfacing with Mobile SDRAM)
http://direct.xilinx.com/bvdocs/appnotes/xapp399.pdf
(Assigning CoolRunner-II VREF Pins)
CoolRunner-II Data Sheets
http://direct.xilinx.com/bvdocs/publications/ds090.pdf
(CoolRunner-II Family Datasheet)
http://direct.xilinx.com/bvdocs/publications/ds091.pdf
(XC2C32 Datasheet)
http://direct.xilinx.com/bvdocs/publications/ds092.pdf
(XC2C64 Datasheet)
information on the Xilinx website. For Pb-free
1,000
2,000
Min
20
–0.5
–0.5
Min.
–40
–65
Max
CoolRunner-II CPLD Family
-
-
-
Cycles
Max.
150
150
Units
Years
Volts
2.0
4.0
Unit
°C
°C
V
V
13