CY7C68034-56LTXI Cypress Semiconductor, CY7C68034-56LTXI Datasheet - Page 37

no-image

CY7C68034-56LTXI

Manufacturer Part Number
CY7C68034-56LTXI
Description
USB Interface IC EZ-USB NX2LP-Flex Flash Controller
Manufacturer
Cypress Semiconductor
Datasheet

Specifications of CY7C68034-56LTXI

Rohs
yes
Product
USB 2.0
Data Rate
96 Mbps
Interface Type
I2C
Operating Supply Voltage
3.3 V
Operating Supply Current
43 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QFN-56
Minimum Operating Temperature
- 40 C
Figure 21
needs to be designed to enable at least 50% solder coverage. The thickness of the solder paste template should be 5 mil. It is
recommended that ‘No Clean’ type 3 solder paste is used for mounting the part. Nitrogen purge is recommended during reflow.
Figure 22
Document Number: 001-04247 Rev. *J
is a plot of the solder mask pattern and
displays a cross-sectional area underneath the package. The cross section is of only one via. The solder paste template
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 21. Cross-section of the Area Underneath the QFN Package.
PCB Material
Figure 22. Plot of the Solder Mask (White Area)
Figure 23. X-ray Image of the Assembly
Figure 23
Cu Fill
displays an X-Ray image of the assembly (darker areas indicate solder).
Solder Mask
0.013” dia
0.017” dia
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and the Ground Plane.
Cu Fill
PCB Material
CY7C68033/CY7C68034
Page 37 of 40

Related parts for CY7C68034-56LTXI