PIC32MX440F512H-80I/MR Microchip Technology, PIC32MX440F512H-80I/MR Datasheet - Page 168

IC PIC MCU FLASH 512KX32 64-QFN

PIC32MX440F512H-80I/MR

Manufacturer Part Number
PIC32MX440F512H-80I/MR
Description
IC PIC MCU FLASH 512KX32 64-QFN
Manufacturer
Microchip Technology
Series
PIC® 32MXr

Specifications of PIC32MX440F512H-80I/MR

Core Size
32-Bit
Program Memory Size
512KB (512K x 8)
Core Processor
MIPS32® M4K™
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Controller Family/series
PIC32
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
5
Interface
EUSART, I2C, SPI, USB
No. Of Pwm Channels
5
Embedded Interface Type
EUSART, I2C, SPI, USB
Rohs Compliant
Yes
Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C, JTAG, SPI, TWI, UART, USB
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
51
Number Of Timers
5
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
PIC32MX3XX/4XX
TABLE A-1:
DS61143F-page 166
Section 28.0 “Electrical
Characteristics”
Section 29.0 “Packaging Information” Added 64-Lead QFN package marking information to Section 29.1
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
In Section 28.1 “DC Characteristics” :
Added the 64-Lead QFN package to Table 28-3.
Updated data in Table 28-5.
Updated data in Table 28-7.
Updated data in Section 28.2 “AC Characteristics and Timing Parame-
ters” , Table 28-4, Table 28-5, Table 28-7 and Table 28-8.
Updated data in Table 28-10.
Added OS42 parameter to Table 28-17.
Replaced Table 28-23.
Replaced Table 28-24.
Replaced Table 28-25.
Updated Table 28-36.
“Package Marking Information” .
Added the 64-Lead QFN (MR) package drawing and land pattern to
Section 29.2 “Package Details” .
Added the MR package designator for the 64-Lead (9x9x0.9) QFN.
Preliminary
Update Description
© 2009 Microchip Technology Inc.

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