C8051F331-GM Silicon Laboratories Inc, C8051F331-GM Datasheet - Page 22
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C8051F331-GM
Manufacturer Part Number
C8051F331-GM
Description
IC 8051 MCU 8K FLASH 20QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F33xr
Specifications of C8051F331-GM
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
20-QFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
17
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F330DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
No. Of I/o's
17
Ram Memory Size
768Byte
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1451 - ADAPTER PROGRAM TOOLSTICK F330336-1264 - DEV KIT FOR C8051F330/F331
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1265
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F331-GM
Manufacturer:
SiliconL
Quantity:
1 630
Part Number:
C8051F331-GM
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Part Number:
C8051F331-GMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
C8051F330/1/2/3/4/5
1.2.
The CIP-51 has a standard 8051 program and data address configuration. It includes 256 bytes of data
RAM, with the upper 128 bytes dual-mapped. Indirect addressing accesses the upper 128 bytes of general
purpose RAM, and direct addressing accesses the 128 byte SFR address space. The lower 128 bytes of
RAM are accessible via direct and indirect addressing. The first 32 bytes are addressable as four banks of
general purpose registers, and the next 16 bytes can be byte addressable or bit addressable.
Program memory consists of 2/4/8 kB of Flash. This memory may be reprogrammed in-system in 512 byte
sectors, and requires no special off-chip programming voltage. See Figure 1.9 for the MCU system mem-
ory map.
24
On-Chip Memory
0x1DFF
0x1E00
0x0FFF
0x0000
0x1000
0x0000
0x0000
0x7FF
0x800
PROGRAM/DATA MEMORY
PROGRAM/DATA MEMORY
PROGRAM/DATA MEMORY
Programmable in 512
Programmable in 512
Programmable in 512
C8051F330/1
C8051F332/3
C8051F334/5
Byte Sectors)
Byte Sectors)
Byte Sectors)
RESERVED
RESERVED
RESERVED
8 K FLASH
4 K FLASH
2 K FLASH
(In-System
(In-System
(In-System
(FLASH)
(FLASH)
(FLASH)
Figure 1.9. On-Board Memory Map
0xFFFF
0x01FF
0x0200
0x0000
Rev. 1.7
0xFF
0x7F
0x2F
0x1F
0x80
0x30
0x20
0x00
0x0000 to 0x01FF, wrapped
XRAM - 512 Bytes
(accessable using MOVX
Same 512 bytes as from
(Indirect Addressing
on 512-byte boundaries
(Direct and Indirect
INTERNAL DATA ADDRESS SPACE
EXTERNAL DATA ADDRESS SPACE
General Purpose
Upper 128 RAM
Bit Addressable
Addressing)
instruction)
Registers
Only)
DATA MEMORY (RAM)
(Direct Addressing Only)
Special Function
Lower 128 RAM
(Direct and Indirect
Addressing)
Register's