C8051F331-GM Silicon Laboratories Inc, C8051F331-GM Datasheet - Page 36
![IC 8051 MCU 8K FLASH 20QFN](/photos/12/16/121620/c8051f331-gm_sml.jpg)
C8051F331-GM
Manufacturer Part Number
C8051F331-GM
Description
IC 8051 MCU 8K FLASH 20QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F33xr
Specifications of C8051F331-GM
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
20-QFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
17
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F330DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
No. Of I/o's
17
Ram Memory Size
768Byte
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1451 - ADAPTER PROGRAM TOOLSTICK F330336-1264 - DEV KIT FOR C8051F330/F331
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1265
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F331-GM
Manufacturer:
SiliconL
Quantity:
1 630
Part Number:
C8051F331-GM
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Part Number:
C8051F331-GMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
C8051F330/1/2/3/4/5
38
Notes:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220, variation VGGD except for
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small
A1
D2
E2
D
A
E
b
e
custom features D2, E2, Z, Y, and L which are toleranced per supplier designation.
Body Components.
0.80
0.00
0.18
2.00
2.00
Min
Table 4.2. QFN-20 Package Dimensions
Figure 4.2. QFN-20 Package Drawing
4.00 BSC.
0.50 BSC.
4.00 BSC.
0.90
0.02
0.23
2.15
2.15
Typ
Max
1.00
0.05
0.30
2.25
2.25
Rev. 1.7
Dimension
aaa
bbb
ddd
eee
L1
Z
Y
L
0.45
0.00
Min
—
—
—
—
—
—
0.55
0.43
0.18
Typ
—
—
—
—
—
Max
0.65
0.15
0.15
0.10
0.05
0.08
—
—