MC9S08JM60CGT Freescale Semiconductor, MC9S08JM60CGT Datasheet - Page 373

• Manufacturer Part Number: MC9S08JM60CGT
• Description: IC MCU 8BIT 60K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08JM60CGT

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: S08JM
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 12-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 24MHz
• Total Internal Ram Size: 4KB
• # I/os (max): 37
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: QFN EP
• Package: 48QFN EP
• Family Name: HCS08
• Maximum Speed: 24 MHz
• Operating Supply Voltage: 3.3|5 V
• For Use With: DEMOJM - KIT DEMO FOR JM MCU FAMILYDEMOJMSKT - BOARD DEMO S08JM CARD W/SOCKET
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering numbers for MC9S08JM60 series devices. See below for an example of the
device numbering system.
B.2
B.3
This following pages contain mechanical specifications for MC9S08JM60 series package options. See
Table B-2
Freescale Semiconductor
Ordering Information
Orderable Part Numbering System
Mechanical Drawings
for the document numbers that correspond to each package type.
1
2
(MC = Fully Qualified)
See
See
(9 = Flash-based)
Device Number
Table 1-1
Table B-2
MC9S08JM60
MC9S08JM32
Pin Count
Memory
Status
Family
44
48
64
64
for a complete description of modules included on each device.
for package information.
Core
1
Table B-1. Device Numbering System
MC 9 S08 JM 60 C XX E
MC9S08JM60 Series Data Sheet, Rev. 3
LQFP
LQFP
Type
QFN
QFP
Table B-2. Package Information
60,912
32,768
Flash
Designator
Memory
QH
GT
LD
LH
4096
2048
RAM
Temperature range
(C = –40°C to 85°C)
Memory size designator
Pb free indicator
Package designator
98ASS23225W
98ASS23234W
Document No.
98ARH99048A
98ASB42844B
Available Packages
64-pin LQFP
44-pin LQFP
48-pin QFN
64-pin QFP
Type
(See
Table
B-2)
2
373