MC9S12GC96MFAE Freescale Semiconductor, MC9S12GC96MFAE Datasheet - Page 659
![IC MCU 96K FLASH 25MHZ 48-LQFP](/photos/12/19/121954/mc9s12gc96mfae_sml.jpg)
MC9S12GC96MFAE
Manufacturer Part Number
MC9S12GC96MFAE
Description
IC MCU 96K FLASH 25MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12GC16MFUE.pdf
(690 pages)
Specifications of MC9S12GC96MFAE
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
31
Program Memory Size
96KB (96K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S12GC
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
31
Number Of Timers
8
Operating Supply Voltage
3.3 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE, M68DKIT912C32SLK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
48LQFP
Family Name
HCS12
Maximum Speed
25 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12GC96MFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12GC96MFAE
Manufacturer:
FRE/MOT
Quantity:
20 000
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A.2.2
The
The following constraints exist to obtain full-scale, full range results: V
This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that
it ties to. If the input level goes outside of this range it will effectively be clipped
1. The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
A.2.3
Three factors — source resistance, source capacitance and current injection — have an influence on the
accuracy of the ATD.
A.2.3.1
Due to the input pin leakage current as specified in
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or
operating conditions are less than worst case or leakage-induced error is acceptable, larger values of source
resistance is allowable.
A.2.3.2
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, C
Freescale Semiconductor
Conditions are shown in
Num C
period of 16 ATD clocks.
1
2
3
4
5
6
7
Table A-11
D
C Differential Reference Voltage
D ATD Clock Frequency
D
D
D Recovery Time (V
P Reference Supply current
Reference Potential
ATD 10-Bit Conversion Period
ATD 8-Bit Conversion Period
ATD Operating Characteristics In 3.3V Range
Factors Influencing Accuracy
Source Resistance
Source Capacitance
shows conditions under which the ATD operates.
Conv, Time at 2.0MHz ATD Clock f
Conv, Time at 2.0MHz ATD Clock f
Table A-4
DDA
=3.3 Volts)
Rating
unless otherwise noted; Supply Voltage 3.3V-10% <= V
Table A-11. ATD Operating Characteristics
MC9S12C-Family / MC9S12GC-Family
Clock Cycles
Clock Cycles
ATDCLK
ATDCLK
Rev 01.24
High
Low
(1)
Table A-6
f
1
≥ 1024 * (C
N
V
T
Symbol
N
f
T
ATDCLK
CONV10
RH
CONV10
CONV8
CONV8
t
I
V
V
REC
REF
RH
RL
-V
RL
in conjunction with the source resistance
INS
V
V
DDA
Min
3.0
0.5
14
12
—
—
– C
SSA
7
6
SSA
/2
INN
DDA
Appendix A Electrical Characteristics
≤ V
).
<= 3.3V+10%
RL
Typ
3.3
—
—
—
—
—
—
—
—
—
≤ V
IN
≤ V
V
0.250
V
Max
DDA
3.6
2.0
28
14
26
13
20
DDA
RH
/2
≤ V
Cycles
Cycles
MHz
Unit
DDA
mA
µs
µs
µs
V
V
V
659
S
.
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