MC9S12GC96MFAE Freescale Semiconductor, MC9S12GC96MFAE Datasheet - Page 683
![IC MCU 96K FLASH 25MHZ 48-LQFP](/photos/12/19/121954/mc9s12gc96mfae_sml.jpg)
MC9S12GC96MFAE
Manufacturer Part Number
MC9S12GC96MFAE
Description
IC MCU 96K FLASH 25MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12GC16MFUE.pdf
(690 pages)
Specifications of MC9S12GC96MFAE
Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
31
Program Memory Size
96KB (96K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S12GC
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
31
Number Of Timers
8
Operating Supply Voltage
3.3 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE, M68DKIT912C32SLK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
48LQFP
Family Name
HCS12
Maximum Speed
25 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12GC96MFAE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12GC96MFAE
Manufacturer:
FRE/MOT
Quantity:
20 000
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C.1.2
Freescale Semiconductor
SEATING
PLANE
-H-
-T-
-L-
52-Pin LQFP Package
C
13
1
4X
52
14
Figure C-2. 52-Pin LQFP Mechanical Dimensions (Case no. 848D-03)
0.20 (0.008) H L-M
S1
C2
A1
C1
VIEW AA
0.05 (0.002)
A
S
3X
4X
4X
-N-
N
VIEW Y
θ2
θ3
S
MC9S12C-Family / MC9S12GC-Family
40
26
Z
39
27
E
K
W
4X 13 TIPS
θ1
0.20 (0.008) T L-M
-M-
θ
Rev 01.24
B1
VIEW AA
2X R
V1
GAGE PLANE
0.10 (0.004) T
0.25 (0.010)
R1
B
V
N
NOTES:
1.
2.
C L
PLATING
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER
DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -H-
DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD
OR PROTRUSION 0.07 (0.003).
0.13 (0.005)
ROTATED 90
DIM
θ2
A1
B1
C1
C2
R1
S1
V1
θ1
θ3
W
A
B
C
D
E
G
K
S
U
V
θ
F
J
Z
J
SECTION AB-AB
AB
AB
MILLIMETERS
MIN
0.05
1.30
0.20
0.45
0.22
0.07
0.08
0.09
10.00 BSC
10.00 BSC
12.00 BSC
12.00 BSC
0
0
5.00 BSC
5.00 BSC
0.65 BSC
0.50 REF
6.00 BSC
6.00 BSC
0.20 REF
1.00 REF
---
12
12
Appendix C Package Information
°
°
°
°
VIEW Y
M
REF
REF
D
°
MAX
F
1.70
0.20
1.50
0.40
0.75
0.35
0.20
0.20
0.16
7
---
T
CLOCKWISE
°
L-M
0.002
0.051
0.008
0.018
0.009
0.003
0.003
0.004
MIN
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
0.026 BSC
0.020 REF
0.472 BSC
0.236 BSC
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0
0
---
12
INCHES
°
°
12
S
°
°
U
REF
REF
0.008
N
0.067
0.059
0.016
0.030
0.014
0.008
0.008
0.006
MAX
BASE METAL
---
7
°
X=L, M, N
S
G
-X-
683
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