PIC18LF2431-I/SP Microchip Technology, PIC18LF2431-I/SP Datasheet - Page 377

IC MCU FLASH 8KX16 28-DIP

PIC18LF2431-I/SP

Manufacturer Part Number
PIC18LF2431-I/SP
Description
IC MCU FLASH 8KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18LF2431-I/SP

Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
24
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
24
Eeprom Memory Size
256Byte
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, SPI, SSP
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
24
Number Of Timers
1 x 8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
APPENDIX E:
A detailed discussion of the differences between the
mid-range MCU devices (i.e., PIC16CXXX) and the
enhanced devices (i.e., PIC18FXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to
PIC18F442.” The changes discussed, while device-
specific, are generally applicable to all mid-range to
enhanced device migrations.
This Application Note is available on Microchip’s
web site: www.Microchip.com.
 2010 Microchip Technology Inc.
MIGRATION FROM
MID-RANGE TO
ENHANCED DEVICES
PIC18F2331/2431/4331/4431
APPENDIX F:
A detailed discussion of the migration pathway and
differences between the high-end MCU devices (i.e.,
PIC17CXXX)
PIC18FXXX) is provided in AN726, “PIC17CXXX to
PIC18FXXX Migration.”
This Application Note is available on Microchip’s
web site: www.Microchip.com.
and
the
MIGRATION FROM
HIGH-END TO
ENHANCED DEVICES
enhanced
DS39616D-page 377
devices
(i.e.,

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