MC9S08EL16CTJ Freescale Semiconductor, MC9S08EL16CTJ Datasheet - Page 332

MCU 16KB FLASH SLIC 20TSSOP

MC9S08EL16CTJ

Manufacturer Part Number
MC9S08EL16CTJ
Description
MCU 16KB FLASH SLIC 20TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08EL16CTJ

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP
Processor Series
S08EL
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI, SPI, I2C, SLIC
Maximum Clock Frequency
200 KHz
Number Of Programmable I/os
16
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08EL32AUTO, DEMO9S08EL32
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
For Use With
DEMO9S08EL32 - BOARD DEMO FOR 9S08 EL MCUDEMO9S08EL32AUTO - DEMO BOARD EL32 AUTO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Appendix A Electrical Characteristics
A.6
This section includes information about power supply requirements and I/O pin characteristics.
334
Num C
1
2
3
4
5
6
— Operating Voltage
C
P
C Output high
C voltage
P
C
D
C
P
C Output low
C voltage
P
C
D
P Input high voltage; all digital inputs
C
DC Characteristics
Output high
current
Output low
current
1
Latch-up
Parameter is achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted.
Model
Human
Body
No.
1
2
3
Characteristic
Series resistance
Storage capacitance
Number of pulses per pin
Minimum input voltage limit
Maximum input voltage limit
Human body model (HBM)
Charge device model (CDM)
Latch-up current at T
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
Table A-5. ESD and Latch-Up Protection Characteristics
high-drive strength
high-drive strength
low-drive strength
low-drive strength
Max total I
Max total I
Table A-4. ESD and Latch-up Test Conditions
Description
All I/O pins,
All I/O pins,
Rating
All I/O pins
AllI/O pins
all ports
all ports
OH
Table A-6. DC Characteristics
OL
1
A
for
for
= 125°C
Symbol
I
V
V
V
I
V
OHT
OLT
OH
DD
OL
IH
5 V, I
5 V, I
5 V, I
5 V, I
3 V, I
3 V, I
5 V, I
5 V, I
5 V, I
5 V, I
3 V, I
3 V, I
Symbol
Symbol
V
V
V
V
I
Condition
R1
HBM
CDM
LAT
Load
Load
OUT
OUT
C
Load
Load
Load
Load
Load
Load
Load
Load
Load
Load
5V
3V
< V
= –20 mA
= –10 mA
> V
= –4 mA
= –2 mA
= –1 mA
= –5 mA
= 20 mA
= 10 mA
= 4 mA
= 2 mA
= 1 mA
= 5 mA
DD
SS
± 2000
± 500
± 100
Min
0.65 x V
V
V
V
V
V
V
0.7 x V
Value
DD
DD
DD
DD
DD
DD
1500
– 2.5
100
7.5
Min
2.7
3
0
0
– 1.5
– 0.8
– 0.8
– 1.5
– 0.8
– 0.8
DD
DD
Max
Typ
Freescale Semiconductor
1
Unit
Unit
mA
pF
Ω
V
V
V
V
–100
Max
100
5.5
1.5
0.8
0.8
1.5
0.8
0.8
Unit
mA
mA
V
V
V
V

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