PIC16F689-I/ML Microchip Technology, PIC16F689-I/ML Datasheet - Page 229

IC PIC MCU FLASH 4KX14 20QFN

PIC16F689-I/ML

Manufacturer Part Number
PIC16F689-I/ML
Description
IC PIC MCU FLASH 4KX14 20QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F689-I/ML

Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
18
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C/SPI/SSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
17
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163029, DM164120
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PIN
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
17.0
Absolute Maximum Ratings
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by PORTA, PORTB and PORTC (combined) ............................................................ 200 mA
Maximum current sourced PORTA, PORTB and PORTC (combined)............................................................ 200 mA
Note 1:
© 2007 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
Voltage spikes below V
Thus, a series resistor of 50-100
pulling this pin directly to V
DD
with respect to V
IK
(1)
OK
(V
DD
............................................................................................................................... 800 mW
I
SS
(Vo < 0 or Vo >V
< 0 or V
pin ........................................................................................................................ 250 mA
pin ..................................................................................................................... 300 mA
SS
I
SS
PIC16F631/677/685/687/689/690
> V
................................................................................................... -0.3V to +6.5V
(†)
SS
at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.
DD
.
SS
)...............................................................................................................± 20 mA
DD
Ω
........................................................................... -0.3V to (V
).........................................................................................................± 20 mA
should be used when applying a “low” level to the MCLR pin, rather than
DIS
= V
DD
x {I
DD
- ∑ I
OH
} + ∑ {(V
DD
- V
OH
) x I
DS41262D-page 227
OH
} + ∑(V
DD
+ 0.3V)
OL
x I
OL
).

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