PIC16F689-I/ML Microchip Technology, PIC16F689-I/ML Datasheet - Page 232

• Manufacturer Part Number: PIC16F689-I/ML
• Description: IC PIC MCU FLASH 4KX14 20QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F689-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 18
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SPI/SSP/EUSART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163029, DM164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PIN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F631/677/685/687/689/690
17.2
DS41262D-page 230
DC CHARACTERISTICS
D010
D011*
D012
D013*
D014
D015
D016*
D017
D018
D019
Legend:
Note 1:
Param
No.
2:
3:
4:
5:
†
DC Characteristics: PIC16F631/677/685/687/689/690-I (Industrial)
Supply Current (I
TBD = To Be Determined
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
The test conditions for all I
rail-to-rail; all I/O pins tri-stated, pulled to V
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
For RC oscillator configurations, current through R
by the formula I
The peripheral current is the sum of the base I
enabled. The peripheral Δ current can be determined by subtracting the base I
values should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
Device Characteristics
R
DD
= V
)
(1, 2)
DD
/2R
DD
EXT
measurements in Active Operation mode are: OSC1 = external square wave, from
Standard Operating Conditions (unless otherwise stated)
Operating temperature
(mA) with R
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ†
0.65
1.30
0.63
140
220
380
260
420
130
215
360
220
375
340
500
410
700
230
400
0.8
0.8
2.6
2.8
18
35
16
31
DD
9
8
EXT
; MCLR = V
DD
in kΩ.
or I
EXT
Max
TBD
TBD
TBD
1.65
3.25
3.35
240
380
550
360
650
220
360
520
340
550
450
700
650
950
400
680
1.1
1.0
1.2
1.1
20
40
65
PD
is not included. The current through the resistor can be extended
and the additional current consumed when this peripheral is
DD
Units
; WDT disabled.
mA
mA
mA
mA
mA
mA
mA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
-40°C ≤ T
V
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
4.5
5.0
DD
A
≤ +85°C for industrial
DD
F
LP Oscillator mode
F
XT Oscillator mode
F
XT Oscillator mode
F
EC Oscillator mode
F
EC Oscillator mode
F
LFINTOSC mode
F
HFINTOSC mode
F
HFINTOSC mode
F
EXTRC mode
F
HS Oscillator mode
DD
OSC
OSC
OSC
OSC
OSC
OSC
OSC
OSC
OSC
OSC
.
or I
= 32 kHz
= 1 MHz
= 4 MHz
= 1 MHz
= 4 MHz
= 31 kHz
= 4 MHz
= 8 MHz
= 4 MHz
= 20 MHz
PD
© 2007 Microchip Technology Inc.
Conditions
current from this limit. Max
(3)
Note