PIC16F689-I/ML Microchip Technology, PIC16F689-I/ML Datasheet - Page 278

• Manufacturer Part Number: PIC16F689-I/ML
• Description: IC PIC MCU FLASH 4KX14 20QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F689-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 18
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SPI/SSP/EUSART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163029, DM164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PIN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F631/677/685/687/689/690
19.2
The following sections give the technical details of the packages.
20-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS41262D-page 276
Note:
NOTE 1
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
A2
E1
.115
.015
.300
.240
.980
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
1.030
NOM
.310
.250
.130
.010
.060
.018
.130
20
–
–
–
Microchip Technology Drawing C04-019B
© 2007 Microchip Technology Inc.
1.060
MAX
.210
.195
.325
.280
.150
.015
.070
.022
.430
–
eB
E
c