PIC18F4431-I/ML Microchip Technology, PIC18F4431-I/ML Datasheet - Page 33

IC PIC MCU FLASH 8KX16 44QFN

PIC18F4431-I/ML

Manufacturer Part Number
PIC18F4431-I/ML
Description
IC PIC MCU FLASH 8KX16 44QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4431-I/ML

Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
36
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
256Byte
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, SPI, SSP
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
1 x 8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
9 bit
Package
44QFN EP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
 Details
2.7.2
The PIC18F2331/2431/4331/4431 devices contain
circuitry to prevent clocking “glitches” when switching
between clock sources. A short pause in the system
clock occurs during the clock switch. The length of this
pause is between 8 and 9 clock periods of the new
clock source. This ensures that the new clock source is
stable and that its pulse width will not be less than the
shortest pulse width of the two clock sources.
Clock transitions are discussed in greater detail in
Section 3.1.2 “Entering Power-Managed Modes”.
2.8
When the device executes a SLEEP instruction, the
system is switched to one of the power-managed
modes, depending on the state of the IDLEN and
SCS1:SCS0 bits of the OSCCON register. See
Section 3.0 “Power-Managed Modes” for details.
When PRI_IDLE mode is selected, the designated
primary oscillator continues to run without interruption.
For all other power-managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2 pin, if used by the oscillator) will stop oscillating.
In
SEC_IDLE), the Timer1 oscillator is operating and
providing the system clock. The Timer1 oscillator may
also run in all power-managed modes if required to
clock Timer1.
In internal oscillator modes (RC_RUN and RC_IDLE),
the internal oscillator block provides the system clock
source. The INTRC output can be used directly to
provide the system clock and may be enabled to
support various special features, regardless of the
power-managed mode (see Section 22.2 “Watchdog
Timer (WDT)” through Section 22.4 “Fail-Safe Clock
Monitor”). The INTOSC output at 8 MHz may be used
directly to clock the system, or may be divided down
first. The INTOSC output is disabled if the system clock
is provided directly from the INTRC output.
TABLE 2-3:
© 2007 Microchip Technology Inc.
RC, INTIO1
RCIO, INTIO2
ECIO
EC
LP, XT and HS
Note:
secondary
Effects of Power-Managed Modes
on the Various Clock Sources
OSCILLATOR TRANSITIONS
See Table 4-1 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset.
OSC Mode
OSC1 AND OSC2 PIN STATES IN SLEEP MODE
clock
modes
(SEC_RUN
Floating, external resistor
should pull high
Floating, external resistor
should pull high
Floating, pulled by external clock
Floating, pulled by external clock
Feedback inverter disabled at
quiescent voltage level
PIC18F2331/2431/4331/4431
and
Preliminary
OSC1 Pin
If the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Enabling any on-chip feature that will operate during
Sleep will increase the current consumed during Sleep.
The INTRC is required to support WDT operation. The
Timer1 oscillator may be operating to support a Real-
Time Clock. Other features may be operating that do
not require a system clock source (i.e., SSP slave,
INTx pins, A/D conversions and others).
2.9
Power-up delays are controlled by two timers, so that no
external Reset circuitry is required for most applications.
The delays ensure that the device is kept in Reset until
the device power supply is stable under normal
circumstances, and the primary clock is operating and
stable. For additional information on power-up delays,
see Section 4.1 “Power-on Reset (POR)” through
Section 4.5 “Brown-out Reset (BOR)”.
The first timer is the Power-up Timer (PWRT), which
provides a fixed delay on power-up (parameter 33,
Table 25-8), if enabled, in Configuration Register 2L.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the crys-
tal oscillator is stable (LP, XT and HS modes). The OST
does this by counting 1024 oscillator cycles before
allowing the oscillator to clock the device.
When the HSPLL Oscillator mode is selected, the
device is kept in Reset for an additional 2 ms, following
the HS mode OST delay, so the PLL can lock to the
incoming clock frequency.
There is a delay of 5 to 10 μs following POR, while the
controller becomes ready to execute instructions. This
delay runs concurrently with any other delays. This
may be the only delay that occurs when any of the EC,
RC or INTIO modes are used as the primary clock
source.
Power-up Delays
At logic low (clock/4 output)
Configured as PORTA, bit 6
Configured as PORTA, bit 6
At logic low (clock/4 output)
Feedback inverter disabled at
quiescent voltage level
OSC2 Pin
DS39616C-page 31

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